Novel development of the micro-tensile test at elevated temperature using a test structure with integrated micro-heater
Ang, W C, Kropelnicki, P, Soe, Oak, Ling, J H L, Randles, A B, Hum, A J W, Tsai, J M L, Tay, A A O, Leong, K C, Tan, C S
Published in Journal of micromechanics and microengineering (01.08.2012)
Published in Journal of micromechanics and microengineering (01.08.2012)
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Journal Article
Measurement of LED junction temperature using thermoreflectance thermography
Ling, J. H. L., Tay, A. A. O.
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Accurate thermal characterization of a GaN PA MMIC using Thermoreflectance thermography
Ling, J. H. L., Tay, A. A. O., Choo, K. F.
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Measurement of MMIC gate temperature using infrared and Thermoreflectance thermography
Ling, J. H. L., Tay, A. A. O., Choo, K. F., Chen, W., Kendig, D.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding