The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects
Kinney, Chris, Linares, Xioranny, Lee, Kyu-Oh, Morris, J.W.
Published in Journal of electronic materials (01.04.2013)
Published in Journal of electronic materials (01.04.2013)
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Journal Article
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
Linares, Xioranny, Kinney, Chris, Lee, Kyu-Oh, Morris, J. W.
Published in Journal of electronic materials (2014)
Published in Journal of electronic materials (2014)
Get full text
Journal Article
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration : LEAD-FREE SOLDERS
LINARES, Xioranny, KINNEY, Chris, LEE, Kyu-Oh, MORRIS, J. W
Published in Journal of electronic materials (2014)
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Published in Journal of electronic materials (2014)
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