by Tsai, Tsung-Ling, Jiang, Fa-Shen, Ho, Chia-Hua, Lin, Chen-Hsi, Tseng, Tseung-Yuen
Published in IEEE electron device letters (01.10.2016)

by LIN, Chun-Chieh, LIN, Chih-Yang, LIN, Meng-Han, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in IEEE transactions on electron devices (01.12.2007)

by Hudec, Boris, Hsu, Chung-Wei, Wang, I-Ting, Lai, Wei-Li, Chang, Che-Chia, Wang, Taifang, Fröhlich, Karol, Ho, Chia-Hua, Lin, Chen-Hsi, Hou, Tuo-Hung
Published in Science China. Information sciences (01.06.2016)

by Lin, Meng-Han, Wu, Ming-Chi, Huang, Chun-Yang, Lin, Chen-Hsi, Tseng, Tseung-Yuen
Published in Journal of physics. D, Applied physics (28.07.2010)

by Hsu, Hsueh-Chuan, Lin, Hsi-Chen, Wu, Shih-Ching, Hong, Yu-Sheng, Ho, Wen-Fu
Published in Journal of materials science (01.04.2010)

by Huang, Jiun-Jia, Hou, Tuo-Hung, Hsu, Chung-Wei, Tseng, Yi-Ming, Chang, Wen-Hsiung, Jang, Wen-Yueh, Lin, Chen-Hsi
Published in Japanese Journal of Applied Physics (01.04.2012)

by Ho, Wen-Fu, Cheng, Chung-Hsiao, Chen, Wei-Kai, Wu, Shih-Ching, Lin, Hsi-Chen, Hsu, Hsueh-Chuan
Published in Journal of alloys and compounds (05.03.2009)

by Lin, Kuan-Liang, Hou, Tuo-Hung, Lee, Yao-Jen, Chang, Jhe-Wei, Lin, Jun-Hung, Shieh, Jiann, Chou, Cheng-Tung, Lei, Tan-Fu, Chang, Wen-Hsiung, Jang, Wen-Yueh, Lin, Chen-Hsi
Published in Japanese Journal of Applied Physics (01.03.2013)

by LIN, Chih-Yang, LIN, Chun-Chieh, HUANG, Chun-Hsing, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in Surface & coatings technology (15.12.2007)

by LIN, Chun-Chieh, YU, Jung-Sheng, LIN, Chih-Yang, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in Thin solid films (03.12.2007)

by Wu, Ming-Chi, Jang, Wen-Yueh, Lin, Chen-Hsi, Tseng, Tseung-Yuen
Published in Semiconductor science and technology (13.06.2012)

by WU, Ming-Chi, LIN, Yi-Wei, JANG, Wen-Yueh, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in IEEE electron device letters (01.08.2011)

by Peng, Pei-Wen, Ou, Keng-Liang, Lin, Hsi-Chen, Pan, Yung-Ning, Wang, Chau-Hsiang
Published in Journal of alloys and compounds (04.03.2010)

by LIN, Meng-Han, WU, Ming-Chi, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in IEEE transactions on electron devices (01.08.2010)

by LIN, Chun-Chieh, TU, Bing-Chung, LIN, Chao-Cheng, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in IEEE electron device letters (01.09.2006)

by LIN, Chih-Yang, LIN, Meng-Han, WU, Ming-Chi, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in IEEE electron device letters (01.10.2008)

by LIN, Meng-Han, WU, Ming-Chi, HUANG, Yi-Han, LIN, Chen-Hsi, TSENG, Tseung-Yuen
Published in IEEE transactions on electron devices (01.04.2011)

by Lin, Meng-Han, Wu, Ming-Chi, Lin, Chen-Hsi, Tseng, Tseung-Yuen
Published in IEEE transactions on electron devices (01.08.2010)

by Lin, Hsi-Chen, Wu, Shih-Ching, Ho, Wen-Fu, Huang, Ling-Hsiu, Hsu, Hsueh-Chuan
Published in Journal of alloys and compounds (27.08.2010)

by Huang, Chun-Yang, Jieng, Jheng-Hong, Jang, Wen-Yueh, Lin, Chen-Hsi, Tseng, Tseung-Yuen
Published in ECS solid state letters (31.05.2013)