Managing BGA test socket SI characterization
Lin Chee-Hoe, Ng Hui-Ying, Wong Wui-Weng
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Novel impedance matching technique for pogo pin design
Chee-Hoe Lin
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages
Lin Chee-Hoe, Wong Wui-Weng, Liu Bao-Min
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding