Effects of different ascorbic acid doses on the mortality of critically ill patients: a meta-analysis
Wang, Ying, Lin, Huan, Lin, Bing-wen, Lin, Jian-dong
Published in Annals of intensive care (20.05.2019)
Published in Annals of intensive care (20.05.2019)
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Journal Article
PAI-1/PIAS3/Stat3/miR-34a forms a positive feedback loop to promote EMT-mediated metastasis through Stat3 signaling in Non-small cell lung cancer
Lin, Xian, Lin, Bing-wen, Chen, Xiao-li, Zhang, Bei-lei, Xiao, Xiong-jian, Shi, Jing-shi, Lin, Jian-dong, Chen, Xiao
Published in Biochemical and biophysical research communications (02.12.2017)
Published in Biochemical and biophysical research communications (02.12.2017)
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Journal Article
The effects of sowing date on cottonseed properties at different fruiting-branch positions
HU, Wei, CHEN, Mei-li, ZHAO, Wen-qing, CHEN, Bing-lin, WANG, You-hua, WANG, Shan-shan, MENG, Ya-li, ZHOU, Zhi-guo
Published in Journal of Integrative Agriculture (01.06.2017)
Published in Journal of Integrative Agriculture (01.06.2017)
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Journal Article
Study on a Microchip-Integrated Hemorrheology Analysis System
Chen, Li, Zheng, Xiao-lin, Hu, Ning, Jiang, Fan, Lin, Bing-wen, Yang, Jun, Liao, Yan-jian, Luo, Hong-yan
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)
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Journal Article
Susceptible time window and endurable duration of cotton fiber development to high temperature stress
XU, Bo, ZHOU, Zhi-guo, GUO, Lin-tao, XU, Wen-zheng, ZHAO, Wen-qin, CHEN, Bing-lin, MENG, Ya-li, WANG, You-hua
Published in Journal of Integrative Agriculture (01.09.2017)
Published in Journal of Integrative Agriculture (01.09.2017)
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Journal Article
PROCESS CONTROL OF THE SAND WAVE MIGRATION IN BEIBU GULF OF THE SOUTH CHINA SEA
LI, Yong, LIN, Mian, JIANG, Wen-bing, FAN, Feng-xin
Published in Journal of hydrodynamics. Series B (01.08.2011)
Published in Journal of hydrodynamics. Series B (01.08.2011)
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Journal Article
The Effect of Pulse-Reverse Plating Time on Blind Micro Via Filling
Luo, Jen Tsung, Lin, Wen Bing, Shang, Laurence
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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