Lead-free solder wettability of oxidized-aluminum enhanced by Ar-H2 plasmas for flip-chip bumping
Lin, Yung-Sen, Lin, Shiau-Min, Li, Jian-Yi, Liao, Min-Chih
Published in Soldering & surface mount technology (23.01.2018)
Published in Soldering & surface mount technology (23.01.2018)
Get full text
Journal Article
Lead-free solder wettability of oxidized-aluminum enhanced by Ar-H 2 plasmas for flip-chip bumping
Lin, Yung-Sen, Lin, Shiau-Min, Li, Jian-Yi, Liao, Min-Chih
Published in Soldering & surface mount technology (05.02.2018)
Published in Soldering & surface mount technology (05.02.2018)
Get full text
Journal Article