by Lee, Tzu-Nien, Lau, John-H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru-Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia-Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in Materials (24.03.2022)

by Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Lau, John H., Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, J. J., Huang, Patrick Po-Chun, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Lin, Eagle, Chang, Leo
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)

by Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)

by Lau, John H., Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)

by Peng, Tony Chia-Yu, Lau, John H., Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Kai-Ming, Lin, Bruce Puru, Xia, Tim, Chang, Leo, Liu, Hsing-Ning, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)

by Lau, John H., Ko, Cheng-Ta, Tseng, Tzyy-Jang, Yang, Kai-Ming, Peng, Tony Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)

by Lau, John H., Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.07.2020)

by Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.04.2021)

by Lau, John H., Ko, Cheng-Ta, Tseng, Tzvy-Jang, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Cheng, David, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.10.2020)

by Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.04.2021)

by Peng, Chia-Yu, Lau, John H, Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Xia, Tim, Chang, Leo, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)

by Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Peng, Tony Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)

by Peng, Chia-Yu, Lin, Puru Bruce, Ko, Cheng-Ta, Wang, Chi-Wei, Chuang, Oscar, Lee, Chang-Chun
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

by Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Lau, John H, Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Lee, Chang-Chun, Liou, Yan-Yu, Huang, Pei-Chen, Hsu, Fussen, Lin, Puru Bruce, Ko, Cheng-Ta, Chen, Yu-Hua
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)

by Lau, John H, Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, JJ, Huang, Po-Chun, Liu, Hsing Ning, Tseng, Tzvy-Jang
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

by Lin, Yu-Min, Wu, Sheng-Tsai, Wang, Chun-Min, Lee, Chia-Hsin, Huang, Shin-Yi, Lin, Ang-Ying, Chang, Tao-Chih, Lin, Puru Bruce, Ko, Cheng-Ta, Chen, Yu-Hua, Su, Jay, Liu, Xiao, Prenger, Luke, Chen, Kuan-Neng
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)