SiO2 tunneling and Si3N4/HfO2 trapping layers formed with low temperature processes on gate-all-around junctionless charge-trapping flash memory devices
Fang, Hsin-Kai, Chang-Liao, Kuei-Shu, Cheng, Chia-Hsin, Lin, Po-Yao, Huang, Wen-Hsien, Shen, Chang-Hong, Shieh, Jia-Min
Published in Microelectronics and reliability (01.12.2018)
Published in Microelectronics and reliability (01.12.2018)
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Journal Article
New method of WLCSP for process optimization and reliability prediction
Chin-Yu Ku, Wei-Chi Huang, Young-Chang Lien, Ming-Chih Yew, Po-Yao Lin, Hsiu-Mei Yu
Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
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Conference Proceeding
3D Heterogeneous Integration with Multiple Stacking Fan-Out Package
Feng-Cheng Hsu, Lin, Jackson, Shuo-Mao Chen, Po-Yao Lin, Fang, Jerry, Jin-Hua Wang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages
Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Shyue-Ter Leu, Shin-Puu Jeng
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill
Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Fan-out wafer molding process optimization using cure-dependent viscoelastic modeling and characterizations
Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages
Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Lidded FCCSP warpage evaluation: Process modeling and characterization of the effect of viscoelasticity and cured shrinkage for molded underfill
Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Shyue-Ter Leu
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Characterization methodologies for copper/polymer interfacial strength
Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
A novel integrated warpage prediction model based on characterization of viscoelasticity in time domain and chemical shrinkage for molded underfill
Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Shyue-Ter Leu, Kuo-Chuan Liu
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Thermal Challenges for HPC 3DIC Packages and Systems
Yan, Kathy, Lin, Po-Yao, Kuo, Sheng-Liang
Published in 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (06.03.2022)
Published in 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (06.03.2022)
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Conference Proceeding
Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling
Lin, Po-Yao, Kuo, Sheng-Liang, Yan, Kathy, Chen, Wen-Ming, Liao, Marvin De-Dui
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages
Lin, Po-Yao, Yew, M. C., Yeh, S. S., Chen, S. M., Lin, C. H., Chen, C. S., Hsieh, C. C., Lu, Y. J., Chuang, P. Y., Cheng, H. K., Jeng, Shin-Puu
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Thermal Challenges for HPC 3DFabricTM Packages and Systems
Yan, Kathy Wei, Lin, Po-Yao, Kuo, Sheng-Liang
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process
Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Liao, Li-Ling, Lin, Yu-Sheng, Jeng, Shin-Puu
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding