Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications
Laicun Lin, Mingchuan Zhang, Delong Qiu, Xiangmeng Jing, Feng Jiang, Daquan Yu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications
Lin, Laicun, Jing, Xiangmeng, Wang, Qidong, Jiang, Feng, Cao, Liqiang, Yu, Daquan
Published in Microsystem technologies : sensors, actuators, systems integration (2016)
Published in Microsystem technologies : sensors, actuators, systems integration (2016)
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Journal Article
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Year of Publication 21.08.2024
Patent
Chip package device
Lin, Laicun, Liu, Guowen, Zhang, Huafeng, Zheng, Shuai, Tang, Jiajie, Ye, Guanhong
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Year of Publication 30.08.2022
Patent
Package structure with antenna in package and communications device
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Year of Publication 26.07.2022
Patent
PACKAGING STRUCTURE HAVING ANTENNA IN PACKAGE AND COMMUNICATION DEVICE
DONG, Hailin, TANG, Jiajie, LIN, Laicun, LIU, Liangsheng, CHANG, Ming, QU, Heng
Year of Publication 23.06.2021
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Year of Publication 23.06.2021
Patent
PACKAGING STRUCTURE HAVING ANTENNA IN PACKAGE AND COMMUNICATION DEVICE
DONG, Hailin, TANG, Jiajie, LIN, Laicun, LIU, Liangsheng, CHANG, Ming, QU, Heng
Year of Publication 17.02.2021
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Year of Publication 17.02.2021
Patent
PACKAGE STRUCTURE WITH ANTENNA IN PACKAGE AND COMMUNICATIONS DEVICE
DONG, Hailin, TANG, Jiajie, LIN, Laicun, LIU, Liangsheng, CHANG, Ming, QU, Heng
Year of Publication 11.02.2021
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Year of Publication 11.02.2021
Patent
WAFER PACKAGE DEVICE
TANG, Jiajie, YE, Guanhong, LIN, Laicun, LIU, Guowen, ZHANG, Huafeng, ZHENG, Shuai
Year of Publication 06.01.2021
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Year of Publication 06.01.2021
Patent
CHIP PACKAGE DEVICE
TANG, Jiajie, YE, Guanhong, LIN, Laicun, LIU, Guowen, ZHANG, Huafeng, ZHENG, Shuai
Year of Publication 05.11.2020
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Year of Publication 05.11.2020
Patent
WAFER PACKAGE DEVICE
TANG, Jiajie, YE, Guanhong, LIN, Laicun, LIU, Guowen, ZHANG, Huafeng, ZHENG, Shuai
Year of Publication 14.10.2020
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Year of Publication 14.10.2020
Patent