The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders
Guo, Wei-Ting, Liang, Chien-Lung, Lin, Kwang-Lung
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (18.03.2019)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (18.03.2019)
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Journal Article
Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders
Lin, Jeng-Chi, Liang, Chien-Lung, Lin, Kwang-Lung
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (23.09.2019)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (23.09.2019)
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Journal Article
The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate
Chang, Che-Wei, Lin, Kwang-Lung
Published in Journal of materials science. Materials in electronics (01.07.2019)
Published in Journal of materials science. Materials in electronics (01.07.2019)
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Journal Article
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
Chen, Wei-Yu, Chiu, Tsung-Chieh, Lin, Kwang-Lung, Wu, Albert T., Jang, Wei-Luen, Dong, Chung-Li, Lee, Hsin-Yi
Published in Scripta materialia (01.03.2013)
Published in Scripta materialia (01.03.2013)
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Journal Article
High dislocation density of tin induced by electric current
Liao, Yi-Han, Liang, Chien-Lung, Lin, Kwang-Lung, Wu, Albert T.
Published in AIP advances (01.12.2015)
Published in AIP advances (01.12.2015)
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Journal Article