A New IC Solder Joint Inspection Method for an Automatic Optical Inspection System Based on an Improved Visual Background Extraction Algorithm
Cai, Nian, Lin, Jianfa, Ye, Qian, Wang, Han, Weng, Shaowei, Ling, Bingo Wing-Kuen
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2016)
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Journal Article
Study on the influence of waste glass powder replacing fly ash on the performance of concrete
Wang, Yongding, Wu, Faxiang, Zhang, Zhichao, Lin, Jianfa, Bao, Longxiang
Published in Journal of physics. Conference series (01.07.2023)
Published in Journal of physics. Conference series (01.07.2023)
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Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning
Chen, Wenjie, Cai, Nian, Wang, Huiheng, Lin, Jianfa, Wang, Han
Published in Soldering & surface mount technology (15.03.2021)
Published in Soldering & surface mount technology (15.03.2021)
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Los Angeles Metro Bus Data Analysis Using GPS Trajectory and Schedule Data (Demo Paper)
Nguyen, Kien, Yang, Jingyun, Lin, Yijun, Lin, Jianfa, Yao-Yi, Chiang, Shahabi, Cyrus
Published in arXiv.org (03.09.2019)
Published in arXiv.org (03.09.2019)
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