TSV Integration with Chip Level TSV-to-Pad Cu/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking
Hung, Tzu-Heng, Lo, James Yi-Jen, Kuo, Tzu-Ying, Shih, Shing-Yih, Huang, Sheng-Fu, Lin, Yen-Ling, Chiu, Hsih-Yang, Li, Wei-Zhong, Hu, Han-Wen, Chang, Hsiang-Hung, Shih, Chiang-Lin, Lin, Jeff J.P., Chen, Kuan-Neng
Published in IEEE electron device letters (01.07.2023)
Published in IEEE electron device letters (01.07.2023)
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