Efficiencies of chitosan nanoparticles and crab shell particles in europium uptake from aqueous solutions through biosorption: Synthesis and characterization
Cadogan, Elon I., Lee, Ching-Hwa, Popuri, Srinivasa R., Lin, Hang-Yi
Published in International biodeterioration & biodegradation (01.11.2014)
Published in International biodeterioration & biodegradation (01.11.2014)
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Journal Article
Multilayer RDL Interposer for Heterogeneous Device and Module Integration
Lin, Yi-Hang, Yew, M.C., Chen, S.M., Liu, M.S., Kavle, Pravin, Lai, T.M., Yu, C.T., Hsu, F.C., Chen, C.S., Fang, T.J., Hsu, C.K., Lee, K.C., Lin, C.H., Lin, P.Y., Jeng, Shin-Puu
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
A new indexing method with high storage utilization and retrieval efficiency for large spatial databases
Lin, Hung-Yi, Huang, Po-Whei, Hsu, Kuang-Hua
Published in Information and software technology (01.08.2007)
Published in Information and software technology (01.08.2007)
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Journal Article
ANASTOMOSIS SET, ANASTOMOTIC AUXILIARY AND THE METHOD THEREOF
Huang, Cheng Tung, Huang, Hsin-Lei, Lin, Hang-Yi, Hong, Wei-Chen, Huang, Hsin-Hui
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
Patent
Chip package structure with ring structure and method for forming the same
Yeh, Shu-Shen, Lin, Yi-Hang, Yang, Che-Chia, Lai, Po-Chen, Wang, Chin-Hua, Lin, Po-Yao, Lee, Kuang-Chun, Jeng, Shin-Puu
Year of Publication 15.08.2023
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Year of Publication 15.08.2023
Patent
CHIP PACKAGE STRUCTURE WITH RING STRUCTURE
LIN, Po-Yao, LEE, Kuang-Chun, LAI, Po-Chen, YEH, Shu-Shen, WANG, Chin-Hua, LIN, Yi Hang, JENG, Shin-Puu, YANG, Che-Chia
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
Patent
ANASTOMOSIS SET, ANASTOMOTIC AUXILIARY AND THE METHOD THEREOF
Huang, Cheng Tung, Huang, Hsin-Lei, Lin, Hang-Yi, Hong, Wei-Chen, HUANG, HSIN-HUI
Year of Publication 18.06.2020
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Year of Publication 18.06.2020
Patent
CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME
LIN, Po-Yao, LEE, Kuang-Chun, LAI, Po-Chen, YEH, Shu-Shen, WANG, Chin-Hua, JENG, Shin-Puu, LIN, Yi-Hang, YANG, Che-Chia
Year of Publication 15.07.2021
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Year of Publication 15.07.2021
Patent