by Lin, Chung-Han, Wu, Yuan-Kang
Published in IEEE transactions on industry applications (01.09.2023)

by Lu, Guan-Liang, Lin, Chung-Han, Wu, Yuan-Kang
Published in IEEE transactions on industry applications (01.07.2021)

by Lin, Chung-Han, Wu, Yuan-Kang
Published in IEEE access (2021)

by Tsai, Chi-Chin, Lin, Chung-Han
Published in Soil dynamics and earthquake engineering (1984) (01.10.2018)

by Chung-Han Lin, Merz, T. A., Doutt, D. R., Jungwoo Joh, del Alamo, J. A., Mishra, U. K., Brillson, L. J.
Published in IEEE transactions on electron devices (01.10.2012)

by Chang, Meng-Yang, Lee, Nien-Chia, Lee, Ming-Fang, Huang, Yu-Ping, Lin, Chung-Han
Published in Tetrahedron letters (10.11.2010)

by Chang, Meng-Yang, Lin, Chung-Han
Published in Journal of the Chinese Chemical Society (Taipei) (01.12.2011)

by Lien, Guo-Yuan, Lin, Chung-Han, Huang, Zih-Mao, Teng, Wen-Hsin, Chen, Jen-Her, Lin, Ching-Chieh, Ho, Hsu-Hui, Huang, Jyun-Ying, Hong, Jing-Shan, Cheng, Chia-Ping, Huang, Ching-Yuang
Published in Monthly weather review (01.07.2021)

by Lin, Chung-Han, Wu, Yuan-Kang
Published in 2022 IEEE Industry Applications Society Annual Meeting (IAS) (09.10.2022)

by Lin, Han-Chung, Wang, Wei-E., Brammertz, Guy, Meuris, Marc, Heyns, Marc
Published in Microelectronic engineering (01.07.2009)

by Wu, Yuan-Kang, Lu, Guan-Liang, Lin, Chung-Han
Published in 2020 IEEE Industry Applications Society Annual Meeting (10.10.2020)

by Chien, Chun-Cheng, Lin, Han-Chung, Ya-Hui Lien, Bella
Published in Total quality management & business excellence (01.02.2015)

by Chang, Meng-Yang, Lin, Chung-Han, Tai, Hang-Yi
Published in Tetrahedron letters (12.06.2013)

by Chang, Meng-Yang, Lin, Chung-Han, Chen, Yeh-Long
Published in Tetrahedron letters (10.03.2010)

by KO, Fu-Kuang, HUANG, Chang-Bin, TSENG, Pei-Ying, LIN, Chung-Han, ZHENG, Bo-Yan, CHIU, Hsiu-Mei
Published in Energy policy (2010)

by Wu, Bing-Fei, Huang, Po-Wei, He, Da-Hong, Lin, Chung-Han, Chen, Kuan-Hung
Published in 2019 IEEE International Conference on Systems, Man and Cybernetics (SMC) (01.10.2019)

by Chang, Meng-Yang, Lee, Tein-Wei, Lin, Chung-Han
Published in Tetrahedron (01.07.2011)

by Chang, Meng-Yang, Lin, Chung-Han, Lee, Tein-Wei
Published in Tetrahedron letters (08.02.2012)

by Chang, Meng-Yang, Lee, Ming-Fang, Lin, Chung-Han, Lee, Nein-Chia
Published in Tetrahedron letters (16.02.2011)

by Sharifi, H., Lahiji, R.R., Han-Chung Lin, Ye, P.D., Katehi, L.P.B., Mohammadi, S.
Published in IEEE transactions on advanced packaging (01.02.2009)