Electronic Packaging Interfacial Strength Measurement and Delamination Investigation
Shih, Meng-Kai, Liu, Yu-Hao, Lin, Guan-Sian, Hsu, Eddie, Yang, Jonny
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
Next-Generation High-Density PCB Development by Fan-Out RDL Technology
Shih, Meng-Kai, Huang, Yu-Wei, Lin, Guan-Sian
Published in IEEE transactions on device and materials reliability (01.06.2022)
Published in IEEE transactions on device and materials reliability (01.06.2022)
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Magazine Article