Extensive investigations of temperature influence on barrier integrity during reliability testing
Aubel, O., Meyer, M.A., Feustel, F., Engelmann, H.J., Zienert, I., Poppe, J., Schmidt, H., Gehre, D., Geisler, H., Langer, E., Limbecker, P., Foltyn, T., Witt, C., Yao, W., Thierbach, S., Koschinsky, F., Zistl, C.
Published in Microelectronic engineering (01.10.2008)
Published in Microelectronic engineering (01.10.2008)
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Journal Article
Conference Proceeding
Integration Aspects of CoWP Capping Layers for Electromigration Enhancement
Preusse, A., Seidel, R., Aubel, O., Nopper, M., Freudenberg, B., Schaller, M., Fecher, M., Letz, T., Bartsch, C., Ott, A., Friedemann, M., Feustel, F., Meyer, M.A., Limbecker, P.
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding