An Inductively Powered Implantable Blood Flow Sensor Microsystem for Vascular Grafts
Cheong, Jia Hao, Lim, Li Shiah, He, Cairan, Singh, Pushpapraj, Park, Woo-Tae, Je, Minkyu, Ng, Simon Sheung Yan, Liu, Xin, Xue, Rui-Feng, Lim, Huey Jen, Khannur, Pradeep Basappa, Chan, Kok Lim, Lee, Andreas Astuti, Kang, Kai
Published in IEEE transactions on biomedical engineering (01.09.2012)
Published in IEEE transactions on biomedical engineering (01.09.2012)
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Journal Article
Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy
Jie Li Aw, Jong Bum Lee, Jaafar, Norhanani, Mian Zhi Ding, Li-Shiah Lim, Chong Ser Choong, Rao, Vempati Srinivasa
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Newly developed integration method for biomedical implants using flexible polymer cable
Yu Daquan, Cheng Ming-Yuan, Lim Li Shiah, Myo Paing, Yu Aibin
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting
Mian Zhi Ding, Jie Li Aw, Li Shiah Lim, Leong Ching Wai, Rao, Vempati Srinivasa
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Implantable blood flow sensor integrated on flexible circuit for vascular graft application
Li Shiah Lim, Jia Hao Cheong, Jerry, J. L. A., He, C.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Three chips stacking with low volume solder using single re-flow process
Khan, Navas, Wee, David Ho Soon, Ong Siong Chiew, Sharmani, Cheryl, Li Shiah Lim, Hong Yu Li, Vasarala, Shekar
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
MEMS Tri-axial Tactile Sensor packaging using polymer fleible cable for sensorised guide wire application
Hamidullah, M., Ming-Yuan Cheng, Li Shiah Lim, Cairan He, Huanhua Feng, Woo Tae Park
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
A wirelessly powered and interrogated blood flow monitoring microsystem fully integrated with a prosthetic vascular graft for early failure detection
Jia Hao Cheong, Chee Keong Ho, Ng, Simon Sheung Yan, Rui-Feng Xue, Hyouk-Kyu Cha, Khannur, Pradeep Basappa, Xin Liu, Lee, Andreas Astuti, Endru, Ferguson Noviar, Park, Woo-Tae, Li Shiah Lim, He, Cairan, Minkyu Je
Published in 2012 IEEE Asian Solid State Circuits Conference (A-SSCC) (01.12.2012)
Published in 2012 IEEE Asian Solid State Circuits Conference (A-SSCC) (01.12.2012)
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Conference Proceeding
Batteryless MEMS flow sensor within prosthetic vascular graft
Cairan He, Li-Shiah Lim, Hamidullah, Muhammad, Singh, Pushpapraj, Woo-Tae Park, Han-Hua Feng
Published in 2011 Defense Science Research Conference and Expo (DSR) (01.08.2011)
Published in 2011 Defense Science Research Conference and Expo (DSR) (01.08.2011)
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Conference Proceeding
Ultra-low-power wireless implantable blood flow sensing microsystem for vascular graft applications
Rui-Feng Xue, Jia Hao Cheong, Hyouk-Kyu Cha, Xin Liu, Peng Li, Huey Jen Lim, Li Shiah Lim, Ming-Yuan Cheng, Cairan He, Woo-Tae Park, Minkyu Je
Published in 2011 International Symposium on Integrated Circuits (01.12.2011)
Published in 2011 International Symposium on Integrated Circuits (01.12.2011)
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Conference Proceeding
Development of multi-chip bonding on an integrated packaging platform for silicon photonics
Chee-Wei Tan, Qing-Xin Zhang, Teo, C W-L, Li-Shiah Lim, Ming-Bin Yu, Lo, P
Published in 2010 Photonics Global Conference (01.12.2010)
Published in 2010 Photonics Global Conference (01.12.2010)
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Conference Proceeding
Force transmitting element fabrication and characterization for MEMS tri-axial force sensor application
Hamidullah, M, Li Shiah Lim, Noor, S J, Daquan Yu, Woo Tae Park, Lichun Shao, Ramakhrisna, K, Hanhua Feng
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator
Aibin Yu, Premachandran, C S, Nagarajan, Ranganathan, Choi Won Kyoung, Lam Quynh Trang, Kumar, Rakesh, Li Shiah Lim, Han, Johnny He, Yap Guan Jie, Damaruganath, Pinjala
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Optimization and Characterization of Flexible Polymeric Optical Waveguide Fabrication Process for Fully Embedded Board-level Optical Interconnects
Lim Li Shiah, Teo, C., Hong Lor Yee, Tan Chee Wei, Chai, J., Yap Guan Jie, Lim Teck Guan, Ramana, P.V., Lau, J.H., Chang, R., Chang, H., Tang, T., Chiang, S., Cheng, D., Tseng, T.J.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Electrical Interconnect Design Optimization for Fully Embedded Board-level Optical Interconnects
Chai, J., Guan Jie Yap, Teck Guan Lim, Chee Wei Tan, Yee Mong Khoo, Teo, C., Li Shiah Lim, Yee, H.L., Ramana, P.V., Lau, J., Chang, R., Tang, T., Chang, H., Chiang, S., Cheng, D., Tseng, T.J.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Wireless sensor microsystems for emerging biomedical applications (Invited)
Je, Minkyu, Cheong, Jia Hao, Ho, Chee Keong, Sheung Yan Ng, Simon, Xue, Rui-Feng, Cha, Hyouk-Kyu, Liu, Xin, Park, Woo-Tae, Lim, Li Shiah, He, Cairan, Cheng, Kuang-Wei, Zou, Xiaodan, Chen, Zhiming, Yao, Lei, Cheng, San Jeow, Li, Peng, Liu, Lei, Cheng, Ming-Yuan, Duan, Zhu, Rajkumar, Ramamoorthy, Zheng, Yuanjin, Goh, Wang Ling, Guo, Yongxin, Dawe, Gavin
Published in 2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) (01.08.2015)
Published in 2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) (01.08.2015)
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Conference Proceeding
Development of thin film dielectric embedded 3D stacked package
Ho, Soon Wee, Su, Nandar, Lim, Li Shiah, Ong, Siong Chiew, Lee, Wen Sheng, Rao, Vempati Srinivasa
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boards
Chang, C.C., Chang, C.J., Lau, John H., Chang, Al, Tang, Tom, Chiang, Steve, Lee, Maurice, Tseng, T. J., Wei, Tan Chee, Shiah, Lim Li, Jie, Yap Guan, Teo, Calvin, Chai, Joey
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding