A More Comprehensive Solution for Tri-Material Layers Subjected to Thermal Stress
Wong, E.H., Thiam Beng Lim
Published in IEEE transactions on components and packaging technologies (01.03.2008)
Published in IEEE transactions on components and packaging technologies (01.03.2008)
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Journal Article
Analytical Solutions for Interconnect Stress in Board Level Drop Impact
Wong, E.H., Yiu-Wing Mai, Seah, S.K.W., Kian-Meng Lim, Thiam Beng Lim
Published in IEEE transactions on advanced packaging (01.11.2007)
Published in IEEE transactions on advanced packaging (01.11.2007)
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Journal Article
Chemical Modification of Silicon (100) Surface via UV-Induced Graft Polymerization
Zhang, Junfeng, Cui, Cheng Qiang, Lim, Thiam Beng, Kang, En-Tang, Neoh, Koon Gee, Lim, Sin Leng, Tan, Kuang Lee
Published in Chemistry of materials (19.04.1999)
Published in Chemistry of materials (19.04.1999)
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Journal Article
Functionalization of self-assembled monolayers on gold by UV-induced graft polymerization
Zhang, Junfeng, Cui, Cheng Qiang, Lim, Thiam Beng, Kang, En-Tang
Published in Macromolecular chemistry and physics (01.09.2000)
Published in Macromolecular chemistry and physics (01.09.2000)
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Journal Article
Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
Shaoyu Wu, Kang, E.T., Neoh, K.G., Cui, C.Q., Thiam Beng Lim
Published in IEEE transactions on advanced packaging (01.08.2000)
Published in IEEE transactions on advanced packaging (01.08.2000)
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Journal Article
Moisture diffusion and vapour pressure modeling of IC packaging
Wong, Ee Hua, Teo, Yong Chua, Lim, Thiam Beng
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article
Reliability assessment of BGA packages
Geok-Leong Tan, Chuan-Yau Hoo, Gerard Chew, Jim-Hee Low, Nam-Beng Tay, Chakravorty, K.K., Thiam-Beng Lim
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper
Liu, Y.X., Kang, E.T., Neoh, K.G., Zhang, J.F., Cui, C.Q., Thiam Beng Lim
Published in IEEE transactions on advanced packaging (01.05.1999)
Published in IEEE transactions on advanced packaging (01.05.1999)
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Journal Article
Conference Proceeding
The impact of underfill properties on the thermomechanical reliability of FCOB assembly
Lu, Jicun, Wu, Jianhua, Pin Liew, Yih, Beng Lim, Thiam, Zong, Xiangfu
Published in Soldering & surface mount technology (01.08.2000)
Published in Soldering & surface mount technology (01.08.2000)
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Journal Article
Advances in Vapor Pressure Modeling for Electronic Packaging
Wong, E.H., Koh, S.W., Lee, K.H., Kian-Meng Lim, Lim, T.B., Yiu-Wing Mai
Published in IEEE transactions on advanced packaging (01.11.2006)
Published in IEEE transactions on advanced packaging (01.11.2006)
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Journal Article
Low-stress leadframe design for plastic IC packages
Bhandarkar, N., Lim Thiam Beng
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Investigation on the effect of copper leadframe oxidation on package delamination
Chai Tai Chong, Leslie, A., Lim Thiam Beng, Lee, C.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding
Journal Article
ENHANCED RELIABILITY BALL GRID ARRAY PACKAGE
HO HONG MENG, HONG MENG HO, TEO YONG CHUA, THIAM BENG LIM, YONG CHUA TEO, LIM THIAM BENG
Year of Publication 28.10.2005
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Year of Publication 28.10.2005
Patent
Packaging R&D in Singapore
Iyer, M.K., Too Poi Siong, Teo Kong Hwa, Lim Thiam Beng
Published in Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 (2003)
Published in Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 (2003)
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Conference Proceeding
Enhancing moisture resistance of PBGA
Teo, Yong Chua, Wong, Ee Hua, Lim, Thiam Beng
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article