Active Through-Silicon Interposer Based 2.5D IC Design, Fabrication, Assembly and Test
Jayabalan, Jayasanker, Chidambaram, Vivek, Siang, Sharon Lim Pei, Xiangyu, Wang, Ming Chinq, Jong, Bhattacharya, Surya
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Ultra-Thin FO Package-on-Package for Mobile Application
Hsiao, Hsiang-Yao, Ho, Soon Wee, Lim, Simon Siak Boon, Wai, Leong Ching, Chong, Ser Choong, Sharon Lim, Pei Siang, Han, Yong, Chai, Tai Chong
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications
Siang Lim, Sharon Pei, Chong, Ser Choong, Chidambaram, Vivek
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Numerical and Experimental Investigation of Package Warpage of Large Mold-First FOWLP
Zhang, Xiaowu, Lim, Sharon Pei Siang, Lau, Boon Long, Han, Yong, Jong, Ming Chinq, Wang, Xiaobai, Liu, Songlin
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Assembly process characterization of 3D Stacking of Heterogeneous Chiplets
Siang Lim, Sharon Pei, Long Lau, Boon, Chai, Tai Chong, Liang Ye, Yong
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer
Lim, Sharon Pei-Siang, Mian Zhi Ding, Velez Sorono, Dexter, Cereno, Daniel Ismael, Jong Kai Lin, Rao, Vempati Srinivasa
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Vertical Stacking of Heterogeneous Chiplets of Duplexer on LNA/SOI
Chong, Chai Tai, Rotaru, Mihai, Xiangyu, Wang, Pei Siang, Sharon Lim, Lin, Ji, Mandal, Rathin, Mani, Raju, Chinq, Jong Ming, Yong Liang, Ye
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Process Development and Reliability of Microbumps
Lim, Sharon Pei-Siang, Rao, Vempati Srinivasa, Wai Yin Hnin, Wai Leong Ching, Kripesh, Vaidyanathan, Lee, Charles, Lau, John, Milla, Juan, Fenner, Andy
Published in IEEE transactions on components and packaging technologies (01.12.2010)
Published in IEEE transactions on components and packaging technologies (01.12.2010)
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Journal Article
Heterogeneous Integration with Embedded Fine Interconnect
Chong, Chai Tai, Guan, Lim Teck, Ho, David, Yong, Han, Choong, Chong Ser, Pei Siang, Sharon Lim, Bhattacharya, Surya
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer
Chong, Chai Tai, Long, Lau Boon, Siang, Sharon Lim Pei, Wee, David Ho Soon, van Kampen, Rob, Castillou, Paul, Gaddi, Roberto, Barron, Lance, Renault, Mickael, Ko, Jay, Hammond, Jonathan
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Comprehensive Study of Copper Nano-Paste for Cu-Cu Bonding
Chong, Ser Choong, Lim Sharon, Pei Siang
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Double Mold Antenna in Package for 77 GHz Automotive Radar
Ho, Soon Wee, Boon, Soh Siew, Long, Lau Boon, Hsiang-Yao, Hsiao, Choong, Chong Ser, Pei Siang, Sharon Lim, Guan, Lim Teck, Chong, Chai Tai
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Yield Improvement in Chip to Wafer Hybrid Bonding
Choong Chong, Ser, Cereno Daniel, Ismael, Lim Pei Siang, Sharon, Shim Cheng Yi, Joseph, Lai Wai Song, Alvin, Leng Loh, Woon
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Ultrathin Die Pick-Up for 3D Chip Stacking
Kawano, Masaya, Hirota, Naoya, Lim, Sharon Pei-Siang, Chong, Ser-Choong
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
Process and materials considerations for Pb-free flip chip packaging of 65nm Cu/low-k device
Tan Ai Min, Soh Choew Kheng, Sharon Pei-Siang Lim, Lee, C.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding