Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps
Lim, Gi-Tae, Kim, Byoung-Joon, Lee, Kiwook, Kim, Jaedong, Joo, Young-Chang, Park, Young-Bae
Published in Journal of electronic materials (01.11.2009)
Published in Journal of electronic materials (01.11.2009)
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Journal Article
Conference Proceeding
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps
Jeong, Myeong-Hyeok, Lim, Gi-Tae, Kim, Byoung-Joon, Lee, Ki-Wook, Kim, Jae-Dong, Joo, Young-Chang, Park, Young-Bae
Published in Journal of electronic materials (01.11.2010)
Published in Journal of electronic materials (01.11.2010)
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Journal Article
Electromigration and Thermomigration Characteristics in Flip Chip Sn-3.5Ag Solder Bump
Lee, Jang-Hee, Lim, Gi-Tae, Yang, Seung-Taek, Suh, Min-Suk, Chung, Qwan-Ho, Byun, Kwang-Yoo, Park, Young-Bae
Published in Journal of the Korean Institute of Metals and Materials (01.05.2008)
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Published in Journal of the Korean Institute of Metals and Materials (01.05.2008)
Journal Article
Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing
Byoung-Joon Kim, Gi-Tae Lim, Jaedong Kim, Kiwook Lee, Young-Bae Park, Young-Chang Joo
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Size effect on electromigration reliability of pb-free flip chip solder bump
Jang-Hee Lee, Gi-Tae Lim, Young-Bae Park, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, Kwang-Yoo Byun
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Reliability of Cu pillar bump for flip chip and 3-D SiP
Byoung-Joon Kim, Gi-Tae Lim, Jaedong Kim, Kiwook Lee, Young-Bae Park, Young-Chang Joo
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
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Conference Proceeding
Effects of annealing and electromigration on intermetallic compound formation of Cu pillar bump
Byoung-Joon Kim, Gi-Tae Lim, Jang-Hee Lee, Jaedong Kim, Kiwook Lee, Young-Bae Park, Young-Chang Joo
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps : Phase Stability, phase transformation and reactive phase formation in electronic materials
JEONG, Myeong-Hyeok, LIM, Gi-Tae, KIM, Byoung-Joon, LEE, Ki-Wook, KIM, Jae-Dong, JOO, Young-Chang, PARK, Young-Bae
Published in Journal of electronic materials (2010)
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Published in Journal of electronic materials (2010)
Journal Article
Semiconductor devices and methods of manufacturing semiconductor devices
Yi, Ji Hun, Khim, Jin Young, Lim, Gi Tae, Park, Dong Joo, Choi, Myung Jea, Han, Gyu Wan
Year of Publication 28.05.2024
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Year of Publication 28.05.2024
Patent
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Choi, Mi Kyoung, Choi, Myung Jae, Chang, Min Hwa, Lim, Gi Tae, Kim, Jae Yun
Year of Publication 03.11.2022
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Year of Publication 03.11.2022
Patent
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Yi, Ji Hun, Khim, Jin Young, Lim, Gi Tae, Park, Dong Joo, Choi, Myung Jea, Han, Gyu Wan
Year of Publication 13.04.2023
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Year of Publication 13.04.2023
Patent