Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
Made, Riko I, Gan, Chee Lip, Yan, Liling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong, Thompson, Carl V.
Published in Acta materialia (2012)
Published in Acta materialia (2012)
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Journal Article
Hydrophobicity of model surfaces with closely packed nano- and micro-spheres
Yan, Liling, Wang, Ke, Wu, Jingshen, Ye, Lin
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (15.03.2007)
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (15.03.2007)
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Journal Article
Preparation and Characterization of Fe-Mn Binary Oxide/Mulberry Stem Biochar Composite Adsorbent and Adsorption of Cr(VI) from Aqueous Solution
Liang, Meina, Xu, Shuiping, Zhu, Yinian, Chen, Xu, Deng, Zhenliang, Yan, Liling, He, Huijun
Published in International journal of environmental research and public health (21.01.2020)
Published in International journal of environmental research and public health (21.01.2020)
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Journal Article
Hydrophobicity of Model Surfaces with Loosely Packed Polystyrene Spheres after Plasma Etching
Yan, Liling, Wang, Ke, Wu, Jingshen, Ye, Lin
Published in The journal of physical chemistry. B (15.06.2006)
Published in The journal of physical chemistry. B (15.06.2006)
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Journal Article
Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
Lee, Chengkuo, Yu, Aibin, Yan, Liling, Wang, Haitao, He, Johnny Han, Zhang, Qing Xin, Lau, John H.
Published in Sensors and actuators. A. Physical. (31.08.2009)
Published in Sensors and actuators. A. Physical. (31.08.2009)
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Journal Article
Development of low temperature bonding using in-based solders
Won Kyoung Choi, Daquan Yu, Chengkuo Lee, Liling Yan, Yu, A., Seung Wook Yoon, Lau, J.H., Moon Gi Cho, Yoon Hwan Jo, Hyuck Mo Lee
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint
Liling Yan, Chengkuo Lee, Daquan Yu, Won Kyoung Choi, Aibin Yu, Seung Uk Yoon, Lau, J.H.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
Daquan Yu, Liling Yan, Chengkuo Lee, Won Kyoung Choi, Meei Ling Thew, Chin Keng Fool, Lau, J.H.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging
Chengkuo Lee, Daquan Yu, Aibin Yu, Liling Yan, Haitao Wang, Lau, J.H.
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds
Made, R.I., Chee Lip Gan, Chengkuo Lee, Liling Yan, Aibin Yu, Seung Wook Yoon
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
Published in 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2008)
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Conference Proceeding