Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Bleiker, Simon J, Visser Taklo, Maaike M, Lietaer, Nicolas, Vogl, Andreas, Bakke, Thor, Niklaus, Frank
Published in Micromachines (Basel) (18.10.2016)
Published in Micromachines (Basel) (18.10.2016)
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Journal Article
3D Integration technology: Status and application development
Ramm, P, Klumpp, A, Weber, J, Lietaer, N, Taklo, M, De Raedt, W, Fritzsch, T, Couderc, P
Published in 2010 Proceedings of ESSCIRC (01.09.2010)
Published in 2010 Proceedings of ESSCIRC (01.09.2010)
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Conference Proceeding
High aspect ratio deep RIE for novel 3D radiation sensors in high energy physics applications
Kok, A., Hansen, T.-E., Hansen, T., Jensen, G.U., Lietaer, N., Mielnik, M., Storas, P.
Published in 2009 IEEE Nuclear Science Symposium Conference Record (NSS/MIC) (01.10.2009)
Published in 2009 IEEE Nuclear Science Symposium Conference Record (NSS/MIC) (01.10.2009)
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Conference Proceeding
Development of cost-effective high-density through-wafer interconnects for 3D microsystems
Lietaer, Nicolas, Storås, Preben, Breivik, Lars, Moe, Sigurd
Published in Journal of micromechanics and microengineering (01.06.2006)
Published in Journal of micromechanics and microengineering (01.06.2006)
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Journal Article
Conference Proceeding
First fabrication of full 3D-detectors at SINTEF
Hansen, Thor-Erik, Kok, Angela, Hansen, Trond A, Lietaer, Nicolas, Mielnik, Michal, Storås, Preben, Via, Cinzia Da, Hasi, Jasmine, Kenney, Chris, Parker, Sherwood
Published in Journal of instrumentation (01.03.2009)
Published in Journal of instrumentation (01.03.2009)
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Journal Article
Electrical Characterization and Preliminary Beam Test Results of 3D Silicon CMS Pixel Detectors
Koybasi, O, Alagoz, E, Krzywda, A, Arndt, K, Bolla, G, Bortoletto, D, Hansen, Thor-Erik, Hansen, T A, Jensen, G U, Kok, A, Kwan, S, Lietaer, N, Rivera, R, Shipsey, I, Uplegger, L, Da Via, C
Published in IEEE transactions on nuclear science (01.06.2011)
Published in IEEE transactions on nuclear science (01.06.2011)
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Journal Article
Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC
Koybasi, O, Bortoletto, D, Hansen, T, Kok, A, Hansen, T A, Lietaer, N, Jensen, G U, Summanwar, A, Bolla, G, Kwan, Simon Wing Lok
Published in IEEE transactions on nuclear science (01.10.2010)
Published in IEEE transactions on nuclear science (01.10.2010)
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Journal Article
(Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications
Lietaer, Nicolas, Taklo, Maaike, Schjo̸lberg-Henriksen, Kari, Ramm, P.
Published in ECS transactions (16.04.2010)
Published in ECS transactions (16.04.2010)
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Journal Article
Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs
Lietaer, Nicolas, Summanwar, Anand, Herum, Sara Rund, Nazareno, Leny
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
Published in 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.04.2014)
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Conference Proceeding
Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections
Sugden, Mark W., Junlei Tao, Changqing Liu, Hutt, David A., Whalley, David C., Lietaer, Nicolas
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
TSV development for miniaturized MEMS acceleration switch
Lietaer, Nicolas, Summanwar, Anand, Bakke, Thor, Taklo, Maaike, Dalsjo, Per
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
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Conference Proceeding