Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys
Liao, Xinjiang, Mu, Dekui, Fu, Wei, Huang, Hui, Huang, Han
Published in Materials & design (15.11.2019)
Published in Materials & design (15.11.2019)
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Journal Article
Investigation of the Anisotropy of 4H-SiC Materials in Nanoindentation and Scratch Experiments
Shi, Suhua, Yu, Yiqing, Wang, Ningchang, Zhang, Yong, Shi, Weibin, Liao, Xinjiang, Duan, Nian
Published in Materials (28.03.2022)
Published in Materials (28.03.2022)
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Journal Article
Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire
Yang, Zixing, Huang, Hui, Liao, Xinjiang, Lai, Zhiyuan, Xu, Zhiteng, Zhao, Yanjun
Published in Materials (01.05.2024)
Published in Materials (01.05.2024)
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Journal Article
Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite
Zhang, Yubin, Liao, Xinjiang, Lin, Qiaoli, Mu, Dekui, Lu, Jing, Huang, Hui, Huang, Han
Published in Materials (27.03.2020)
Published in Materials (27.03.2020)
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Journal Article
Molecular cloning, characterization, and immunolocalization of two lactate dehydrogenase homologous genes from Taenia solium
Du, Wuying, Hu, Fengyu, Yang, Yabo, Hu, Dong, Hu, Xuchu, Yu, Xinbing, Xu, Jin, Dai, Jialin, Liao, Xinjiang, Huang, Jiang
Published in Parasitology research (1987) (01.09.2011)
Published in Parasitology research (1987) (01.09.2011)
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Journal Article
Dynamic model and machining mechanism of wire sawing
Lai, Zhiyuan, Huang, Hui, Hu, Zhongwei, Liao, Xinjiang
Published in Journal of materials processing technology (01.01.2023)
Published in Journal of materials processing technology (01.01.2023)
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Journal Article
Mechanical model of diamond wire sawing for curved surfaces
Xu, Zhiteng, Liao, Xinjiang, Chen, Xun, Lai, Zhiyuan, Huang, Hui
Published in International journal of mechanical sciences (15.08.2024)
Published in International journal of mechanical sciences (15.08.2024)
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Journal Article
Experimental study on the formation mechanism of saw marks in wire sawing
Lai, Zhiyuan, Liao, Xinjiang, Yang, Hao, Hu, Zhongwei, Huang, Hui
Published in International journal of mechanical sciences (01.03.2024)
Published in International journal of mechanical sciences (01.03.2024)
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Journal Article
Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy
Liu, Zhuo, Liao, Xinjiang, Fu, Wei, Mu, Dekui, Xu, Xipeng, Huang, Han
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (14.07.2020)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (14.07.2020)
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Journal Article
Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy
Chen, Jinchang, Mu, Dekui, Liao, Xinjiang, Huang, Guoqin, Huang, Hui, Xu, Xipeng, Huang, Han
Published in International journal of refractory metals & hard materials (01.08.2018)
Published in International journal of refractory metals & hard materials (01.08.2018)
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Journal Article
Complex-shaped metal parts high efficiency sawing with diamond wire
Xu, Zhiteng, Huang, Hui, Cui, Changcai, Liao, Xinjiang, Wu, Min, Xue, Zhiping
Published in International journal of mechanical sciences (15.07.2023)
Published in International journal of mechanical sciences (15.07.2023)
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Journal Article
Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond
Liao, Xinjiang, He, Qiqi, Lin, Qiaoli, Mu, Dekui, Huang, Hui, Huang, Han
Published in Applied surface science (28.02.2020)
Published in Applied surface science (28.02.2020)
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Journal Article
Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by Sn Ti active solder
He, Qiqi, Zhang, Yubin, Duan, Nian, Huang, Hui, Mu, Dekui, Liao, Xinjiang
Published in Powder technology (01.10.2020)
Published in Powder technology (01.10.2020)
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Journal Article
Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by SnTi active solder
He, Qiqi, Zhang, Yubin, Duan, Nian, Huang, Hui, Mu, Dekui, Liao, Xinjiang
Published in Powder technology (01.10.2020)
Published in Powder technology (01.10.2020)
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Journal Article
Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures
Liao, Xinjiang, Mu, Dekui, Wang, Jianxin, Huang, Guoqin, Huang, Hui, Xu, Xipeng, Huang, Han
Published in International journal of refractory metals & hard materials (01.08.2017)
Published in International journal of refractory metals & hard materials (01.08.2017)
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Journal Article