Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages
Shih, Meng-Kai, Lai, Weihong, Liao, Tsewei, Chen, Karen, Chen, Dao-Long, Hung, C. P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2022)
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