Stress Analysis Optimization And Prediction Of Stack BGA Solder Joints Under Random Vibration Conditions
Li, Maolin, Huang, Chun-Yue, Wang, Zhuo, Zhang, Huaiquan, Gong, Jinfeng, Liao, Shuaidong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Optimisation of PID control algorithms for lithography wafer stage
Jinfeng, Gong, Huang, Chuyue, Zhang, Huaiquan, Liao, Shuaidong, Lin, Maolin, Wang, Zhuo
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
SMT Placement Station Allocation Optimization Model Design Based on Artificial Bee Colony Algorithm
Zhang, Huaiquan, Huang, Chunyue, Liao, Shuaidong, Gong, Jinfeng, Wang, Zhuo, Li, Maolin
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Object detection of welding defects in SMT electronics production based on deep learning
Liao, Shuaidong, Huang, Chunyue, Zhang, Huaiquan, Gong, Jinfeng, Li, Maolin, Wang, Zhuo
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Finite element simulation of double-layer BGA solder joints under torsional loading conditions and optimization of solder joint morphology parameters
Wang, Zhuo, Huang, Chunyue, Li, Maolin, Gong, Jinfeng, Liao, Shuaidong, Zhang, Huaiquan
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Stress analysis and parameter optimization of Fine-Pitch BGA solder joints under cantilever plate torsion conditions
Wang, Zhuo, Chunyue, Gong, Jinfeng, Zhang, Huaiquan, Liao, Shuaidong, Liu, Shoufu
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
SMT product defect analysis system and method based on machine vision and knowledge spectrogram
LI MAOLIN, HUANG CHUNYUE, LIAO SHUAIDONG, GONG JINFENG, ZHANG HUAIQUAN
Year of Publication 21.10.2022
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Year of Publication 21.10.2022
Patent
SMT production line process defect analysis system and analysis method based on knowledge graph
LI MAOLIN, HUANG CHUNYUE, LIAO SHUAIDONG, GONG JINFENG, ZHANG HUAIQUAN
Year of Publication 18.10.2022
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Year of Publication 18.10.2022
Patent
SMT production line chip mounter fault prediction method based on improved YOLOX and PNN
LI MAOLIN, HUANG CHUNYUE, LIAO SHUAIDONG, GONG JINFENG, ZHANG HUAIQUAN
Year of Publication 20.09.2022
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Year of Publication 20.09.2022
Patent
Method and system for rapidly detecting welding spot defects of SMT production line based on improved Yolox
LI MAOLIN, HUANG CHUNYUE, LIAO SHUAIDONG, GONG JINFENG, ZHANG HUAIQUAN
Year of Publication 12.07.2022
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Year of Publication 12.07.2022
Patent
SMT chip mounter fault management and diagnosis system based on SQL Server database
LI MAOLIN, HUANG CHUNYUE, LIAO SHUAIDONG, GONG JINFENG, ZHANG HUAIQUAN
Year of Publication 18.06.2021
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Year of Publication 18.06.2021
Patent