A Magnetostatic MEMS Switch Designed for Portable Applications
Min Tang, Ebin Liao, Cheng Kuo Cheng, Dayong Lee, Kumar, Rakesh, Yong Hean Lee, Shankar, Ravi, Le Néel, Olivier, Noviello, Giuseppe, Italia, Francesco
Published in Journal of microelectromechanical systems (01.10.2010)
Published in Journal of microelectromechanical systems (01.10.2010)
Get full text
Journal Article
Development of a 60-GHz Bandpass Filter and a Dipole Antenna Using Wafer Transfer Technology
Guo, Yong-Xin, Wang, Jianpeng, Luo, Bin, Liao, Ebin
Published in IEEE electron device letters (01.07.2009)
Published in IEEE electron device letters (01.07.2009)
Get full text
Journal Article
TSV interposer fabrication for 3D IC packaging
Rao, Vempati Srinivasa, Wee, Ho Soon, Vincent, Lee Wen Sheng, Yu, Li Hong, Ebin, Liao, Nagarajan, Ranganathan, Chong, Chai Tai, Zhang, Xiaowu, Damaruganath, Pinjala
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Get full text
Conference Proceeding
Development of 3D silicon module with TSV for system in packaging
Navas Khan, Rao, V.S., Samule Lim, Ho Soon We, Lee, V., Zhang Xiao Wu, Yang Rui, Liao Ebin
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Get full text
Conference Proceeding
Integration of High Aspect Ratio Tapered Silicon Via for Silicon Carrier Fabrication
Ranganathan, N., Ebin, L., Linn, L., Lee, W.S.V., Navas, O.K., Kripesh, V., Balasubramanian, N.
Published in IEEE transactions on advanced packaging (01.02.2009)
Published in IEEE transactions on advanced packaging (01.02.2009)
Get full text
Journal Article
Development of a novel deep silicon tapered via etch process for through-silicon interconnection in 3-D integrated systems
Nagarajan, R., Liao Ebin, Lee Dayong, Soh Chee Seng, Prasad, K., Balasubramanian, N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Get full text
Conference Proceeding
Integration of high aspect ratio tapered silicon via for through-silicon interconnection
Ranganathan, N., Liao Ebin, Linn Linn, Lee, W.S.V., Navas, O.K., Kripesh, V., Balasubramanian, N.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Get full text
Conference Proceeding
Development and Characterization of Silicon via Tapering Process for 3D System in Packaging Application
Ranganathan, N., Liao Ebin, Balasubramanian, N., Prasad, K., Pey, K.L.
Published in 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2007)
Published in 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2007)
Get full text
Conference Proceeding
Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking
Ling Xie, Won Kyoung Choi, Premachandran, C. S., Selvanayagam, C. S., Ke Wu Bai, Ying Zhi Zeng, Siong Chiew Ong, Ebin Liao, Khairyanto, A., Sekhar, V. N., Thew, S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding
Characterization of AuSn Solder in Laser Die Attachment for Photonic Packaging Applications
Liu Ying Ying, Premachandran, C.S., Seung Wook Yoon, Liao Ebin, Nagarajan, R., Ramana, P.V.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Get full text
Conference Proceeding
Micromachined passive magnetostatic relays for portable applications
Min Tang, Ebin Liao, Cheng Cheng Kuo J K, Dayong Lee, Kumar, Rakesh, Yong Hean Lee, Shankar, Ravi, Le Neel, Olivier, Noviello, Giuseppe, Italia, Francesco
Published in 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2010)
Published in 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2010)
Get full text
Conference Proceeding
Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate
Sharma, Gaurav, Chong, Ser Choong, Ebin, Liao, Hui, Cai, Gan, Chee Lip, Kripesh, Vaidyanathan
Published in Thin solid films (26.02.2007)
Published in Thin solid films (26.02.2007)
Get full text
Journal Article
Package structure and method of forming the same
Chen, Yi-Hsiu, Ko, Jia-Ling, Liao, Ebin, Chiou, Wen-Chih, Shih, Hong-Ye
Year of Publication 30.07.2024
Get full text
Year of Publication 30.07.2024
Patent
Semiconductor component having through-silicon vias
Wu, Tsang-Jiuh, Yu, Chia-Lin, Chang, Chun Hua, Yu, Chen-Hua, Liao, Ebin, Huang, Li-Hsien, Wang, Hsiang-Yi, Chiou, Wen-Chih, Kuo, Darryl, Chang, Cheng-Hung
Year of Publication 03.01.2023
Get full text
Year of Publication 03.01.2023
Patent
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Chen, Yi-Hsiu, Ko, Jia-Ling, Liao, Ebin, Chiou, Wen-Chih, Shih, Hong-Ye
Year of Publication 17.09.2020
Get full text
Year of Publication 17.09.2020
Patent
Three-dimensional integrated circuit structure and method of manufacturing the same
Chen, Yi-Hsiu, Ko, Jia-Ling, Liao, Ebin, Chiou, Wen-Chih, Shih, Hong-Ye
Year of Publication 02.06.2020
Get full text
Year of Publication 02.06.2020
Patent