Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards
Lin, Ching-Tsung, Hsi, Chi-Shiung, Wang, Moo-Chin, Chang, Tao-Chih, Liang, Ming-Kann
Published in Journal of alloys and compounds (14.07.2008)
Published in Journal of alloys and compounds (14.07.2008)
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Journal Article
Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads
Hsi, Chi-Shiung, Lin, Ching-Tsung, Chang, Tao-Chih, Wang, Moo-Chin, Liang, Ming-Kann
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.02.2010)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.02.2010)
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Journal Article
Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-1Al Pb-free solder pastes on OSP finished printed circuit boards
LIN, Ching-Tsung, HSI, Chi-Shiung, WANG, Moo-Chin, CHANG, Tao-Chih, LIANG, Ming-Kann
Published in Journal of alloys and compounds (2008)
Get full text
Published in Journal of alloys and compounds (2008)
Journal Article