Fabrication of Wide-Angle and Wideband Visible Antireflection Coating on Flexible Poly(ether sulfone) Substrate Using Ion-Assisted Deposition
Liou, Yeuh-Yeong, Kuo, Li-Hsiang, Hsu, Chih-Hsien, Liu, Wen-Long, Jaing, Cheng-Chung
Published in Japanese Journal of Applied Physics (01.08.2011)
Published in Japanese Journal of Applied Physics (01.08.2011)
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Journal Article
Fabrication of Wide-Angle and Wideband Visible Antireflection Coating on Flexible Poly(ether sulfone) Substrate Using Ion-Assisted Deposition
Liou, Yeuh-Yeong, Kuo, Li-Hsiang, Hsu, Chih-Hsien, Liu, Wen-Long, Jaing, Cheng-Chung
Published in Japanese Journal of Applied Physics (01.08.2011)
Published in Japanese Journal of Applied Physics (01.08.2011)
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Journal Article
Adaptable and integrated packaging platform for MEMS-based combo sensors utilizing innovative wafer-level packaging technologies
Cheng-Hsiang Liu, Hong-Da Chang, Kuo-Hsiang Li, Chen-Han Lin, Chia-Jung Hsu, Tse-Yuan Lin, Hsin-Hung Chou, Hsiao-Chun Huang, Hsin-Yi Liao
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Novel approaches of wafer level packaging for MEMS devices
Cheng-Hsiang Liu, Hong-Da Chang, Hsin-Yi Liao, Kuo-Hsiang Li, Chen-Han Lin, Wei-Yu Chen, Tse-Yuan Lin
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Innovative MEMS Wafer Level Packaging on bonding, molding and assembly process
Cheng-Hsiang Liu, Hong-Da Chang, Hsin-Yi Liao, Kuo-Hsiang Li, Chen-Han Lin, Jung-Pang Huang
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
SPATE: Small-Group PKI-Less Authenticated Trust Establishment
Yue-Hsun Lin, Studer, A, Yao-Hsin Chen, Hsu-Chun Hsiao, Li-Hsiang Kuo, Lee, Jason, McCune, Jonathan M, King-Hang Wang, Krohn, Maxwell, Phen-Lan Lin, Perrig, Adrian, Hung-Min Sun, Bo-Yin Yang
Published in IEEE transactions on mobile computing (01.12.2010)
Published in IEEE transactions on mobile computing (01.12.2010)
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Magazine Article
Conference Proceeding
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
LIN CHEN-HAN, LI KUO-HSIANG, HUANG NAN-JIA, LIAO HSIN-YI, HUANG JUNG-PANG
Year of Publication 01.05.2014
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Year of Publication 01.05.2014
Patent
Semiconductor package and method of forming the same
LIN, CHEN HAN, LIAO, HSIN YI, LI, KUO HSIANG, HUANG, JUNG PANG, HUANG, NAN JIA
Year of Publication 11.08.2016
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Year of Publication 11.08.2016
Patent
Semiconductor package and method of manufacture
LI, KUO-HSIANG, CHANG, CHIANGNG, CHIU, SHIH-KUANG, HUANG, JUNG-PANG, CHANG, HONG-DA
Year of Publication 01.11.2014
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Year of Publication 01.11.2014
Patent
Semiconductor package and method of fabricating same
LIN CHEN-HAN, LI KUO-HSIANG, HUANG NAN-JIA, LIAO HSIN-YI, HUANG JUNG-PANG
Year of Publication 07.05.2014
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Year of Publication 07.05.2014
Patent
Semiconductor package and method of forming the same
LI, KUO-HSIANG, LIN, CHEN-HAN, HUANG, JUNG-PANG, LIAO, HSIN-YI, HUANG, NAN-JIA
Year of Publication 01.05.2014
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Year of Publication 01.05.2014
Patent