Semiconductor industry value chain: characters' technology evolution
Li, Yung-Ta, Huang, Mu-Hsuan, Chen, Dar-Zen
Published in Industrial management + data systems (01.01.2011)
Published in Industrial management + data systems (01.01.2011)
Get full text
Journal Article
A two-directional Arnoldi process and its application to parametric model order reduction
Li, Yung-Ta, Bai, Zhaojun, Su, Yangfeng
Published in Journal of computational and applied mathematics (01.04.2009)
Published in Journal of computational and applied mathematics (01.04.2009)
Get full text
Journal Article
Conference Proceeding
A Structured Quasi-Arnoldi procedure for model order reduction of second-order systems
Li, Yung-Ta, Bai, Zhaojun, Lin, Wen-Wei, Su, Yangfeng
Published in Linear algebra and its applications (15.04.2012)
Published in Linear algebra and its applications (15.04.2012)
Get full text
Journal Article
High Thermal Solution for 3D Integration Package
Chen, Ching Chia, Kao, Nicholas, Wang, Yu Po, Lin, Shane, Li, Yung Ta
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Get full text
Conference Proceeding
Parameterized model order reduction via a two-directional Arnoldi process
Yung-Ta Li, Zhaojun Bai, Yangfeng Su, Xuan Zeng
Published in 2007 IEEE/ACM International Conference on Computer-Aided Design (01.11.2007)
Published in 2007 IEEE/ACM International Conference on Computer-Aided Design (01.11.2007)
Get full text
Conference Proceeding
Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding
Li, Yung-Ta, Xu, Yuan-Hung, Ji, Jiao-Dong, Lin, Chang-Fu, Chung, C. Key
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Get full text
Conference Proceeding
Fluxless Flip Chip Bonding Tech Application for Ultra-High Density Micro-bump Structure
Ji, Jiao-Dong, Li, Yung-Ta, Liao, Shin-Hao, Liao, Chiu-Chen, Lo, Yu-Min, Huang, Hsiang-Hua, Yu, Kuo-Haw, Lin, Chang-Fu, Chung, Key
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Get full text
Conference Proceeding
Best practice: An optimization of assets productivity in semiconductor manufacturing
Yung-Ta Li
Published in 2010 IEEE International Conference on Management of Innovation & Technology (01.06.2010)
Published in 2010 IEEE International Conference on Management of Innovation & Technology (01.06.2010)
Get full text
Conference Proceeding
Uses unexpired patent to re-evaluate innovation performance by h-index and h-core indicators
Chun-Chieh Wang, Yung-Ta Li, Dar-Zen Chen, Mu-Hsuan Huang
Published in 2013 Proceedings of PICMET '13: Technology Management in the IT-Driven Services (PICMET) (01.07.2013)
Get full text
Published in 2013 Proceedings of PICMET '13: Technology Management in the IT-Driven Services (PICMET) (01.07.2013)
Conference Proceeding
Is Foundry only a capacity provider still?: Relations of role playing for semiconductor industry value chain by patent analysis
Yung-Ta Li, Mu-Hsuan Huang, Dar-Zen Chen
Published in 2010 IEEE International Conference on Management of Innovation & Technology (01.06.2010)
Published in 2010 IEEE International Conference on Management of Innovation & Technology (01.06.2010)
Get full text
Conference Proceeding