Search Results - "Li, Yun-Tsung" :: K.UTB vyhledávací portál

Optimize Stencil Apertures to Eliminate SMT Solder Defects by Shadow Moiré for Warpage Measurement

by Hong, Ling-Ying, Li, Yun-Tsung
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)

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Taguchi DoE for ceramic substrate SMT defects improvement

by Chun-Cheng Hsu, Ching-Shan Chien, Tzu-Yin Wei, Yun-Tsung Li, Hsun-Fa Li
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)

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Improve Solder Extrusion for Large Size Stand Alone Module

by Wei, Tzu-Yin, Lin, Cheng-Tso, Li, Hsin-De, Li, Yun-Tsung
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2019)

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Taguchi DoE for Solder Voids Reduction

by Chien, Ching-Shan, Chien, Chien-Wen, Li, Yun-Tsung, Li, Hsun-Fa
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)

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Fine pitch BGA solder joint split in SMT process

by Chun-Chi Chiu, Yun-Tsung Li, Hsun-Fa Li, Chuei-Tang Wang
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)

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Minimize Bottom Termination Component Voids by Board Assembly Process & Design Optimization

by Hong, Ling-Ying, Li, Yun-Tsung, Li, Hsun-Fa
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)

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