Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish
Chi, Panwang, Li, Yesu, Pan, Hongfa, Wang, Yibo, Chen, Nancheng, Li, Ming, Gao, Liming
Published in Materials (19.12.2021)
Published in Materials (19.12.2021)
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Journal Article
Study on the interface mechanism of copper migration failure in solder mask-substrate package
Li, Yesu, Lin, Shengru, Chi, Panwang, Zou, Yuqiang, Yao, Weikai, Li, Ming, Gao, Liming
Published in Microelectronics and reliability (01.02.2023)
Published in Microelectronics and reliability (01.02.2023)
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Journal Article
Research on Reliability of Solder Layer in IGBT Module Packaging
Chi, Panwang, Lin, Shengru, Li, Yesu, Liu, Yiping, Lu, Jicun, Li, Ming, Gao, Liming
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding