Study of die bond on roughened NiPdAu-Ag pre-plated frame with anti-EBO
Cabral, Raymond Solis, Mesa Baquiran, Joseph Aaron, Wu-Hu Li, Miranda, Ariel Lizaba, Mercado, Mary Grace
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC)
Chua, Lin Xiao, Woo, Hui Qin, Yong, Khai Seen, Li, Wu-Hu, Tan, Lay Poh, Gan, Chee Lip
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Plasma cleaning on bond pad surfaces for gold wire bonding
Wu-Hu Li, Reingruber, K., Mais, N., Acuesta, A., Yape, C.A.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Characterization and Fine Mapping of a Novel Rice Narrow Leaf Mutant nal9
Li, Wei, Wu, Chao, Hu, Guocheng, Xing, Li, Qian, Wenjing, Si, Huamin, Sun, Zongxiu, Wang, Xingchun, Fu, Yaping, Liu, Wenzhen
Published in Journal of integrative plant biology (01.11.2013)
Published in Journal of integrative plant biology (01.11.2013)
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Journal Article
Comparative study of NiNiP leadframes from different processes
Wu-Hu Li, Low, Jeffrey Khai Huat, Sax, H, Cabral, R S, De Castro Salazar, E, Low, Pauline Min Wee
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
The value of MSCT and MRI in the diagnosis of hepatic veno-occlusive disease
Pei, Yi-gang, Hu, Dao-yu, Shen, Ya-qi, Wang, Qiu-xia, Hu, Li-wu
Published in Zhonghua gan zang bing za zhi (01.02.2010)
Published in Zhonghua gan zang bing za zhi (01.02.2010)
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Journal Article
In vitro functional characterization of 37 CYP2C9 allelic isoforms found in Chinese Han population
Dai, Da-peng, Wang, Yu-han, Wang, Shuang-hu, Geng, Pei-wu, Hu, Li-ming, Hu, Guo-xin, Cai, Jian-ping
Published in Acta pharmacologica Sinica (01.11.2013)
Published in Acta pharmacologica Sinica (01.11.2013)
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Journal Article
Cu wire bonding in Ni/Pd/Au-Ag and roughened Ni/Pd/Au-Ag pre-plated leadframe packages
Wu-Hu Li, Acuesta, A., Mercado, M. G., Malonzo, N. T., Cabral, R. S.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding