Cu-Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies
Li, Ming-Jui, Breeden, Michael, Wang, Victor, Hollin, Jonathan, Linn, Nyi Myat Khine, Winter, Charles H., Kummel, Andrew, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2020)
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Journal Article
Polymorphism of 17 Y-STR loci in Taiwan population
Huang, Tsun-Ying, Hsu, Yi-Tzu, Li, Jui-Ming, Chung, Ju-Hui, Shun, Chia-Tung
Published in Forensic science international (30.01.2008)
Published in Forensic science international (30.01.2008)
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Journal Article
Effect of Acute Myocardial Infarction on Erythrocytic Glutathione Peroxidase 1 Activity and Plasma Vitamin E Levels
Cheng, Mei-ling, PhD, Chen, Chin-ming, MD, Ho, Hung-yao, PhD, Li, Jui-ming, MSc, Chiu, Daniel Tsun-yee, PhD
Published in The American journal of cardiology (15.02.2009)
Published in The American journal of cardiology (15.02.2009)
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Journal Article
Efficiency enhancement of blue light emitting diodes by eliminating V-defects from InGaN/GaN multiple quantum well structures through GaN capping layer control
Tsai, Sheng-Chieh, Li, Ming-Jui, Fang, Hsin-Chiao, Tu, Chia-Hao, Liu, Chuan-Pu
Published in Applied surface science (01.05.2018)
Published in Applied surface science (01.05.2018)
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Journal Article
Characterization of Low-Temperature Selective Cobalt Atomic Layer Deposition (ALD) for Chip Bonding
Li, Ming-Jui, Breeden, Michael, Wang, Victor, Linn, Nyi Myat Khine, Winter, Charles H., Kummel, Andrew, Bakir, Muhannad S.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
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Conference Proceeding
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THERMAL ATOMIC LAYER DEPOSITION ON CONDUCTIVE CONTACTS AND STRUCTURES FORMED USING THE SAME
Li, Ming-Jui, Bakir, Muhannad, Breeden, Mike, Kummel, Andrew, Hollin, Jonathan, Linn, Nyi Myat Khine, Wang, Victor, Winter, Charles H
Year of Publication 17.10.2024
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Year of Publication 17.10.2024
Patent
Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same
Li, Ming-Jui, Bakir, Muhannad, Breeden, Mike, Kummel, Andrew, Hollin, Jonathan, Linn, Nyi Myat Khine, Wang, Victor, Winter, Charles H
Year of Publication 02.07.2024
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Year of Publication 02.07.2024
Patent
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating
Rajan, Sreejith Kochupurackal, Li, Ming Jui, Bakir, Muhannad S., May, Gary S
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
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Conference Proceeding
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THERMAL ATOMIC LAYER DEPOSITION ON CONDUCTIVE CONTACTS AND STRUCTURES FORMED USING THE SAME
Li, Ming-Jui, Bakir, Muhannad, Breeden, Mike, Kummel, Andrew, Hollin, Jonathan, Linn, Nyi Myat Khine, Wang, Victor, Winter, Charles H
Year of Publication 10.03.2022
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Year of Publication 10.03.2022
Patent