Effects of visceral adipose tissue on anti-tumour necrosis factor-α in Crohn’s disease
Li, Kangrong, Gong, Pan, Zhang, Yongbin, Liu, Minji, Zhang, Zinan, Yu, Xiaoyu, Ye, Mingmei, Tian, Li
Published in Therapeutic advances in gastroenterology (01.01.2023)
Published in Therapeutic advances in gastroenterology (01.01.2023)
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Journal Article
Clinical value of endoscopic ultrasound sound speed in differential diagnosis of pancreatic solid lesion and prognosis of pancreatic cancer
Qiu, Jianing, Li, Kangrong, Long, Xiuyan, Yu, Xiaoyu, Gong, Pan, Long, Yu, Wang, Xiaoyan, Tian, Li
Published in Cancer medicine (Malden, MA) (01.03.2024)
Published in Cancer medicine (Malden, MA) (01.03.2024)
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Journal Article
Electrical characterization and design of hyper-dense interconnect on HD-FOWLP for die to die connectivity for AI and ML accelerator applications
Rotaru, Mihai Dragos, Kangrong, Li
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Frequency Domain Methodology for Evaluating Signal Integrity Performance of Logic to Logic and HBM Interconnect Models for Chiplet Packaging
Kangrong, Li, Rotaru, Mihai Dragos
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
A practical ball‐grid‐array transition modelling methodology for accurate and fast multi‐interposer package simulation
Tang, Lei, Li, Kangrong, Zhou, Xingshe, Yang, Qiao, Pan, Penghui
Published in IET power electronics (01.09.2024)
Published in IET power electronics (01.09.2024)
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Journal Article
Short failure localization in advanced package using optoelectronic sampling terahertz time domain reflectometry and deconvolution method
Liu, Longhai, Li, Kangrong, Yang, Qiao, Shang, Yang, Xu, Zhen, Li, Jining, Xu, Degang, Yao, Jianquan
Published in Microelectronics (01.09.2024)
Published in Microelectronics (01.09.2024)
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Journal Article
Inductive coupling method for on-line frequency response analysis (FRA) for transformer winding diagnostic
Rathnayaka, Sooriya Bandara, Kye Yak See, Prajapati, Manish, Kangrong Li, Narampanawe, Nishshanka Bandara, Fei Fan
Published in TENCON 2017 - 2017 IEEE Region 10 Conference (01.11.2017)
Published in TENCON 2017 - 2017 IEEE Region 10 Conference (01.11.2017)
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Conference Proceeding
In-circuit common-mode impedance measurement for motor drive system
Fei Fan, Kye Yak See, Kangrong Li, Xiong Liu, Zagrodnik, Michael Adam, Gupta, Amit Kumar
Published in 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) (01.06.2017)
Published in 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) (01.06.2017)
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Conference Proceeding
Influence of temperature on transformer's winding defect analysis using inductive probes
Rathnayaka, Sooriya Bandara, See, Kye Yak, Prajapati, Manish, Li, Kangrong, Narampanawe, Nishshanka Bandara, Fan, Fei
Published in 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL) (01.11.2017)
Published in 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL) (01.11.2017)
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Conference Proceeding
Design of a tunable inductor for applications of contactless couplers
Kangrong Li, McDonough, T., Yinchao Chen
Published in 2009 IEEE Antennas and Propagation Society International Symposium (01.06.2009)
Published in 2009 IEEE Antennas and Propagation Society International Symposium (01.06.2009)
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Conference Proceeding
Analysis of Complex BGA Transition for Equivalent Circuit Modeling
Li, Kangrong, Wang, Yanling, Yang, Qiao
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing
Kangrong, Li, Umralkar, Ratan Bhimrao
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Testing Multiple High-Speed Channels using Automated Test Equipment (ATE), SOC 93K, in parallel
Umralkar, Ratan Bhimrao, Kangrong, Li
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
An empirical characterization of a flexible current probe for in-circuit impedance measurement
Narampanawe, Nishshanka Bandara, See, Kye Yak, Rathnayaka, Sooriya Bandara, Zhang, Jie, Li, Kangrong, Chua, Eng Kee, Goh, Wei Peng
Published in 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL) (01.11.2017)
Published in 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL) (01.11.2017)
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Conference Proceeding
Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging
Tang, Lei, Li, Kangrong, Zhou, Xingshe, Yang, Qiao, Pan, Penghui, Wu, Daowei, Li, Baoxia, Wang, Yanling, Kuang, Nailiang, Zhang, Liaoliao
Published in Microelectronics (01.01.2024)
Published in Microelectronics (01.01.2024)
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Journal Article
Systematic Design Considerations for Test Vehicle of TSV Ground Shielding Array
Li, Kangrong, Li, Baoxia, Zhang, Zhiwei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding