Microvia filling by copper electroplating using diazine black as a leveler
Dow, Wei-Ping, Li, Chih-Chan, Su, Yong-Chih, Shen, Shao-Ping, Huang, Chen-Chia, Lee, Cliff, Hsu, Bob, Hsu, Shar
Published in Electrochimica acta (01.10.2009)
Published in Electrochimica acta (01.10.2009)
Get full text
Journal Article
Wide-Band Low Noise Power Amplifiers Covering 2.4 to 7.1 GHz
Li, Chih-Chan, Yang, Hsin-Chia, Shen, Yuan-Chou, Lin, Yi-Syuan, Chi, Sung-Ching, Liao, Yu-Tsung
Published in 2020 6th International Conference on Applied System Innovation (ICASI) (05.11.2020)
Published in 2020 6th International Conference on Applied System Innovation (ICASI) (05.11.2020)
Get full text
Conference Proceeding
Die stacking method
Chiu, Ming-I, Jann, Larry, Hu, Yi-Ting, Li, Chih-Chan, Chang, Chih-Chien, Lin, Chang-Hsi, Chuang, Po-Wen
Year of Publication 25.09.2018
Get full text
Year of Publication 25.09.2018
Patent
Die stacking apparatus and method
Hu Yi-Ting, Jann Larry, Chang Chih-Chien, Li Chih-Chan, Chuang Po-Wen, Lin Chang-Hsi, Chiu Ming-I
Year of Publication 03.01.2017
Get full text
Year of Publication 03.01.2017
Patent
DIE STACKING METHOD
CHIU Ming-I, LI Chih-Chan, CHANG Chih-Chien, LIN Chang-Hsi, CHUANG Po-Wen, JANN Larry, HU Yi-Ting
Year of Publication 06.04.2017
Get full text
Year of Publication 06.04.2017
Patent
DIE STACKING APPARATUS AND METHOD
HU, YI TING, CHIU, MING I, CHANG, CHIH CHIEN, LI, CHIH CHAN, JANN, LARRY, CHUANG, PO WEN, LIN, CHANG HSI
Year of Publication 11.07.2016
Get full text
Year of Publication 11.07.2016
Patent