Electrical qualification of new ultrathin integration techniques
Cazarré, A., Lépinois, F., Marty, A., Pinel, S., Tasselli, J., Bailbé, J.P., Morante, J.R., Murray, F.
Published in Microelectronics and reliability (2003)
Published in Microelectronics and reliability (2003)
Get full text
Journal Article
Ultra-thinned chips integration: technological approach and electrical qualification
Lepinois, F., Pinel, S., Cazarre, A., Tasselli, J., Marty, A., Bailbe, J.-P., Morante, J.R., Murray, F., Gonnard, O.
Published in 2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595) (2002)
Published in 2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595) (2002)
Get full text
Conference Proceeding