by Ulrich, R.K., Schaper, L.W., Morcan, G., Brown, W.D., Ang, S.S., Barlow, F.D., Elshabini, A., Lenihan, T.G., Naseem, H.A., Nelms, D.M., Parkerson, J.
Published in IEEE circuits and devices magazine (01.09.2000)

by Lenihan, T.G., Malshe, A.P., Brown, W.D., Schaper, L.W.
Published in Thin solid films (01.12.1995)

by Lenihan, T.G., Jan Vardaman, E.
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)

by Parkerson, J.P., Schaper, L.W., Lenihan, T.G.
Published in Proceedings 1997 International Conference on Multichip Modules (1997)

by Djakaria, R., Chandran, B.I., Gordon, M.H., Schmidt, W.F., Lenihan, T.G.
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)

by Brown, W.D., Malshe, A.P., Railkar, T.A., Lenihan, T.G., Stone, J.W., Sommers, W.T., Schaper, L.W.
Published in Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) (1998)

by Railkar, T.A., Morrison, W.B., Lenihan, T.G., Brown, W.D., Malshe, A.P.
Published in Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) (1998)