A study of the mechanisms causing surface defects on sidewalls during Si etching for TSV (through Si via)
Choi, Jae Woong, Loh, Woon Leng, Praveen, Sampath Kumar, Murphy, Ramana, Swee, Eugene Tan Kiat
Published in Journal of micromechanics and microengineering (01.06.2013)
Published in Journal of micromechanics and microengineering (01.06.2013)
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Journal Article
3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and Beyond
Kim, Do-Won, Yu, Li Hong, Chang, Ka Fai, Woon Leng, Loh, Ser Choong, Chong, Hong, Cai, Bhattacharya, Surya
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Yield Improvement in Chip to Wafer Hybrid Bonding
Choong Chong, Ser, Cereno Daniel, Ismael, Lim Pei Siang, Sharon, Shim Cheng Yi, Joseph, Lai Wai Song, Alvin, Leng Loh, Woon
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
One-step TSV process development for 4-layer wafer stacked DRAM
Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin, Loh, Woon-Leng, Rao, BSS. Chandra, Chui, King-Jien
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
FOWLP and Si-Interposer for High-Speed Photonic Packaging
Guan, Lim Teck, Ching, Eva Wai Leong, Ching, Jong Ming, Leng, Loh Woon, Wee, David Ho Soon, Bhattacharya, Surya
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
A Novel Method for Air-Gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ)
King-Jien Chui, Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
TSV via last etch integration challenges and etch optimization
Woon Leng Loh, Qin Ren, King Jien Chui
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
TSV CMP processes on bonded wafers
Yingjun Mao, Qin Ren, Woon Leng Loh
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
CMP process optimization on temporary-bonded wafer for via-last through-silicon-via from backside
Qin Ren, Woon Leng Loh, Chui, K., Ying Jun Mao, Wickramanayanaka, Sunil
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Through silicon via (TSV) scallop smoothening technique
Wong, Goon Heng, Chui, King Jien, Lau, Guan Kian, Woon, Leng Loh, HongYu, Li
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
A Cost-Effective, CMP-Less, Via-Last TSV Process for High Density RDL Applications
King-Jien Chui, Woon Leng Loh, Chunmei Wang, Ka-Fai Chang, Qin Ren, Gilho Hwang, Hung-Ming Chua, Mingbin Yu
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
TSV via-last: Optimization of multilayer dielectric stack etching
Loh Woon Leng, Li Hongyu, Keng Hwa Teo, Murthy, R., Kiat, Eugene Tan Swee
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Dishing study of polyimide CMP process
Yingjun Mao, Gim Guan Chen, Murthy, R., Tan, Eugene, Woon Leng Loh
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Ultra-high selectivity TSV etching hardmask process development and integration for 3D-SIC
Guan Kian Lau, Praveen, S. K., Lee, S., Woon Leng Loh, Deng Wei, Paulasaari, J., Thomas, D., Laukkanen, M., McLaughlin, W., Rantala, J. T., Hong Yu Li, Gao Shan
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
TSV Cu Filling Failure Modes and Mechanisms Causing the Failures
Jae Woong Choi, Ong Lee Guan, Mao Yingjun, Yusoff, Hilmi B. Mohamad, Xie Jielin, Chow Choi Lan, Woon Lengv Loh, Boon Long Lau, Hong, Linda Liew Hwee, Lau Guan Kian, Murthy, Ramana, Kiat, Eugene Tan Swee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2014)
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Journal Article
EPIC Via Last on SOI Wafer Integration Challenges
Loh, Woon Leng, Ren, Qin
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Wafer Warpage Evaluation of Through Si Interposer (TSI) with Different Temporary Bonding Materials
Loh, Woon Leng, Chui, King-Jien
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding