SiC engineered substrate: increasing SiC MOSFETs current density from device to module level
Guiot, Eric, Allibert, Frederic, Leib, Jurgen, Becker, Tom, Drouin, Alexis, Schwarzenbach, Walter
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
Published in 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) (25.02.2024)
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Conference Proceeding
Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications
Ngo, Ha-Duong, Hiess, Andre, Seidemann, Volker, Studzinski, Daniel, Lange, Martin, Leib, Jürgen, Shariff, Dzafir, Ashraf, Huma, Steel, Mike, Atabo, Lilian, Reast, Jon
Published in Journal of physics. Conference series (01.04.2006)
Published in Journal of physics. Conference series (01.04.2006)
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Journal Article
Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device through the Use of SmartSiCTM Substrate
Erlbacher, Tobias, Leib, Jürgen, Becker, Tom, Hellinger, Carsten, Guiot, Eric, Allibert, Frédéric, Schwarzenbach, Walter, Rouchier, Séverin
Published in Materials science forum (06.06.2023)
Published in Materials science forum (06.06.2023)
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Journal Article