Vapor-Phase Self-Assembled Monolayer With Functional Groups as a Copper Diffusion Barrier Layer for InSnZnO Thin-Film Transistors
Lu, Haodong, Zhong, Wei, Lei, Dengyun, Chen, Yayi, Ni, Yao, Liu, Zhen, Lai, Canxiong, Chen, Rongsheng, Kwok, Hoi Sing, Liu, Yuan
Published in IEEE transactions on electron devices (01.04.2024)
Published in IEEE transactions on electron devices (01.04.2024)
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Journal Article
Demonstration of 3D Convolution Kernel Function Based on 8-Layer 3D Vertical Resistive Random Access Memory
Huo, Qiang, Liu, Ming, Song, Renjun, Lei, Dengyun, Luo, Qing, Wu, Zhenhua, Wu, Zuheng, Zhao, Xiaojin, Zhang, Feng, Li, Ling
Published in IEEE electron device letters (01.03.2020)
Published in IEEE electron device letters (01.03.2020)
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Journal Article
A Homogeneous, Reconfigurable, and Efficient Implementation of PUF in 3-D Selector-Free RRAM
Wang, Yiming, Huo, Qiang, Xu, Xiaoxin, Tan, Fei, Gao, Rui, Luo, Qing, Yang, Yiming, Ren, Qirui, Zhao, Xiaojin, Wang, Xinghua, Lei, Dengyun, Zhang, Feng
Published in IEEE transactions on electron devices (01.05.2021)
Published in IEEE transactions on electron devices (01.05.2021)
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Journal Article
A Security-Enhanced, Charge-Pump-Free, ISO14443-A-/ISO10373-6-Compliant RFID Tag With 16.2-μW Embedded RRAM and Reconfigurable Strong PUF
Ren, Qirui, Huo, Qiang, Chen, Zhisheng, Gao, Qi, Wang, Yiming, Yang, Yiming, Wu, Hao, Fu, Xiangqu, Xu, Xiaoxin, Luo, Qing, Gao, Jianfeng, Chen, Chengying, Zhao, Xiaojin, Lei, Dengyun, Wang, Xinghua, Zhang, Feng, Chen, Yong, Mak, Pui-In
Published in IEEE transactions on very large scale integration (VLSI) systems (01.02.2023)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.02.2023)
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Journal Article
Recent Progress in Organic Electrochemical Transistor-Structured Biosensors
Hu, Zhuotao, Hu, Yingchao, Huang, Lu, Zhong, Wei, Zhang, Jianfeng, Lei, Dengyun, Chen, Yayi, Ni, Yao, Liu, Yuan
Published in Biosensors (Basel) (04.07.2024)
Published in Biosensors (Basel) (04.07.2024)
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Journal Article
A Novel RFID Authentication Protocol Based on Reconfigurable RRAM PUF
Ren, Qirui, Fu, Xiangqu, Wu, Hao, Yang, Kaiqi, Lei, Dengyun, Xing, Guozhong, Zhang, Feng
Published in Micromachines (Basel) (15.12.2021)
Published in Micromachines (Basel) (15.12.2021)
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Journal Article
Compatibility of the BSIM-CMG to the Low-Frequency Noise Simulation in Subthreshold and Linear Regions of Amorphous InZnO TFTs
Chen, Yayi, Liu, Xingji, Lei, Dengyun, Liu, Yuan, Chen, Rongsheng, Ni, Yao, Kwok, Hoi-Sing, Zhong, Wei
Published in IEEE journal of the Electron Devices Society (2024)
Published in IEEE journal of the Electron Devices Society (2024)
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Journal Article
FLALM: A Flexible Low Area-Latency Montgomery Modular Multiplication on FPGA
Xie, Yujun, Liu, Yuan, Zheng, Xin, Lan, Bohan, Lei, Dengyun, Xiang, Dehao, Cai, Shuting, Xiong, Xiaoming
Published in IEEE transactions on computers (10.09.2024)
Published in IEEE transactions on computers (10.09.2024)
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Journal Article
Layer-dependent resistance variability assessment on 2048 8-layer 3D vertical RRAMs
Gao, Rui, Lei, Dengyun, He, Zhiyuan, En, Yunfei, Huang, Yun
Published in Electronics letters (22.08.2019)
Published in Electronics letters (22.08.2019)
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Journal Article
A novel hardware Trojan detection method based on sweep‐frequency test
He, Chunhua, Lei, Dengyun, Wu, Heng, Cheng, Lianglun, Huang, Qinwen, Yan, Guizhen
Published in Electronics letters (01.11.2022)
Published in Electronics letters (01.11.2022)
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Journal Article
A 144-fJ/Bit Reliable and Compact TRNG Based on the Diffusive Resistance of 3-D Resistive Random Access Memory
Li, Xiaoran, Wang, Yiming, Yang, Yiming, Lv, Shidong, Luo, Qing, Wang, Xinghua, Xu, Xiaoxin, Lei, Dengyun, Zhang, Feng
Published in IEEE transactions on electron devices (01.08.2023)
Published in IEEE transactions on electron devices (01.08.2023)
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Journal Article
Effect of Moisture Stress on the Resistance of HfO 2 /TaO x -Based 8-Layer 3D Vertical Resistive Random Access Memory
Gao, Rui, Lei, Dengyun, He, Zhiyuan, Chen, Yiqiang, Huang, Yun, En, Yunfei, Xu, Xiaoxin, Zhang, Feng
Published in IEEE electron device letters (01.01.2020)
Published in IEEE electron device letters (01.01.2020)
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Journal Article
A computing-in-memory macro based on three-dimensional resistive random-access memory
Huo, Qiang, Yang, Yiming, Wang, Yiming, Lei, Dengyun, Fu, Xiangqu, Ren, Qirui, Xu, Xiaoxin, Luo, Qing, Xing, Guozhong, Chen, Chengying, Si, Xin, Wu, Hao, Yuan, Yiyang, Li, Qiang, Li, Xiaoran, Wang, Xinghua, Chang, Meng-Fan, Zhang, Feng, Liu, Ming
Published in Nature electronics (01.07.2022)
Published in Nature electronics (01.07.2022)
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Journal Article
Study of silver alloy wire decapsulation methods for failure analysis
Huiwei Wu, Yingyou Liang, Weiping Du, Shengzong He, Youliang Wang, Dengyun Lei
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
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Conference Proceeding
Failure mechanisms and package reliability issues in optocouplers
Huiwei Wu, Shengzong He, Xuanlong Chen, Guangning Xu, Dengyun Lei
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Quality Evaluation of Digital Soft IP Core for FPGA System
Dengyun Lei, Li-wei Wang, Jun Lin, Yunfei En
Published in 2017 IEEE International Conference on Software Quality, Reliability and Security Companion (QRS-C) (01.07.2017)
Published in 2017 IEEE International Conference on Software Quality, Reliability and Security Companion (QRS-C) (01.07.2017)
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Conference Proceeding