Ultra-low loss on-chip magnetic inductors in the far-BEOL for high frequency power electronics
Ali, Zishan, Peng, Lulu, Rohlfs, Patrick, Ng, Yong Chau, Lehmann, Lothar, Cheng, Chor Shu, Selvaraj, Lawrence, Wieland, Marcel
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
Published in 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (30.05.2021)
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Conference Proceeding
Silicon-based Ultimate Miniature Magnetic Inductors Technology for High-efficiency DC-DC Conversion
Peng, Lulu, Ali, Zishan, Selvaraj, Lawrence, Cheng, Chor Shu, Ng, Yong Chau, Yosokumoro, Nur Aziz, Lehmann, Lothar, Rohlfs, Patrick, Wieland, Marcel
Published in 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.09.2020)
Published in 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.09.2020)
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Conference Proceeding
On-Chip Thin Film Inductor for High Frequency DC-DC Power Conversion Applications
Selvaraj, S. Lawrence, Haug, Martin, Cheng, Chor Shu, Dinulovic, Dragan, Peng, Lulu, Shafey, Khaled El, Ali, Zishan, Shousha, Mahmoud, Ng, Yong Chau, Aziz Yosokumoro, Nur, Lehmann, Lothar, Wieland, Marcel
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
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Conference Proceeding
Electrically Inactive Dopants in Heavily Doped As-Grown Czochralski Silicon
Lehmann, Lothar, Zschorsch, Markus, Elsayed, Mohamed, Krause-Rehberg, Reinhard, Friedrich, Jochen, Stockmeier, Ludwig
Published in Solid state phenomena (23.10.2015)
Published in Solid state phenomena (23.10.2015)
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Journal Article
METHODS OF FORMING BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER
KOSGALWIES SVEN, JUNGNICKEL GOTTHARD, LEHMANN LOTHAR, PLATZ ALEXANDER, KUECHENMEISTER FRANK
Year of Publication 03.05.2013
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Year of Publication 03.05.2013
Patent
CPI challenges to BEOL at 28nm node and beyond
Ryan, Vivian, Breuer, D., Geisler, H., Kioussis, D., Lehr, M. U., Paul, J., Machani, K., Shah, Chirag, Kosgalwies, S., Lehmann, L., Jaesik Lee, Kuechenmeister, F., Ryan, E. T., Karimanal, K.
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
A METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
WIELAND MARCEL, JUNGNICKEL GOTTHARD, WALTER AXEL, LEHR MATTHIAS, LEHMANN LOTHAR, PLATZ ALEXANDER, KUECHENMEISTER FRANK
Year of Publication 09.07.2009
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Year of Publication 09.07.2009
Patent
Electronic control unit for operating an electric motor having a braking resistor
Gurr, Kay-Steffen, Lehmann, Lothar, Saemann, Rudolf, Liebhard, Gernot
Year of Publication 15.06.2021
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Year of Publication 15.06.2021
Patent
In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, Iuliana, Panchenko, Iuliana, Boettcher, Mathias, Wolf, Juergen M., Kunz, Martin, Lehmann, Lothar, Atanasova, Tanya, Wieland, Marcel
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding
METHODS OF FORMING BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER
SVEN KOSGALWIES, FRANK KUECHENMEISTER, LOTHAR LEHMANN, ALEXANDER PLATZ, GOTTHARD JUNGNICKEL
Year of Publication 28.05.2015
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Year of Publication 28.05.2015
Patent
INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER
KOSGALWIES SVEN, JUNGNICKEL GOTTHARD, LEHMANN LOTHAR, PLATZ ALEXANDER, KUECHENMEISTER FRANK
Year of Publication 23.01.2014
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Year of Publication 23.01.2014
Patent
Methods of forming bump structures that include a protection layer
KOSGALWIES SVEN, JUNGNICKEL GOTTHARD, LEHMANN LOTHAR, PLATZ ALEXANDER, KUECHENMEISTER FRANK
Year of Publication 12.11.2013
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Year of Publication 12.11.2013
Patent