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Year of Publication 25.12.2018
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Year of Publication 25.12.2018
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DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
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Year of Publication 25.10.2018
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Year of Publication 25.10.2018
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Semiconductor Packages and Methods for Manufacturing Thereof
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Year of Publication 23.06.2022
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Year of Publication 23.06.2022
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Vorrichtung mit Substrat mit leitfähigen Säulen
Ng, Chee Yang, Lee, Swee Kah, Chiang, Chau Fatt, Solomko, Valentyn, Chua, Kok Yau
Year of Publication 19.04.2018
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Year of Publication 19.04.2018
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DEVICE HAVING SUBSTRATE WITH CONDUCTIVE PILLARS
Lee, Swee Kah, NG, Chee Yang, Chiang, Chau Fatt, Solomko, Valentyn, Chua, Kok Yau
Year of Publication 19.04.2018
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Year of Publication 19.04.2018
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Encapsulated package with exposed conductive structures and sidewall recesses
WANG RUIQUAN, GOH SOON LOCK, CHEN ZHIWEN, LEE SWEE KAH, CHEE HONG LEE, LI CAIQI
Year of Publication 29.12.2023
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Year of Publication 29.12.2023
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Pressure Sensor
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Year of Publication 28.01.2021
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Year of Publication 28.01.2021
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PRESSURE SENSOR
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Year of Publication 27.01.2021
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Year of Publication 27.01.2021
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SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING
CHUA, Kok Yau, NG, Chee Yang, CHAN, Sook Woon, CHIANG, Chau Fatt, LEE, Swee Kah
Year of Publication 23.01.2019
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Year of Publication 23.01.2019
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Molded Semiconductor Package
Chong, Hock Heng, Ng, Mei Chin, Lee, Swee Kah, Soriano, Aileen Manantan, Lum, Fong Mei, Muhammat Sanusi, Muhammad, Goh, Soon Lock
Year of Publication 02.01.2020
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Year of Publication 02.01.2020
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Molded cavity package with embedded conductive layer and enhanced sealing
Chua Kok Yau, Lee Swee Kah, Theuss Horst, Ng Chee Yang, Chiang Chau Fatt
Year of Publication 16.01.2018
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Year of Publication 16.01.2018
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METHOD OF MANUFACTURING PACKAGE AND PACKAGE
LIU CHAO YAN, NG CHEE YANG, SUSAI PRAKASAM JOSEPH VICTOR, LEE SWEE KAH, CHEN HUIQIN
Year of Publication 20.10.2023
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Year of Publication 20.10.2023
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Molded semiconductor package having an optical inspection feature
Chong, Hock Heng, Ng, Mei Chin, Lee, Swee Kah, Soriano, Aileen Manantan, Lum, Fong Mei, Muhammat Sanusi, Muhammad, Goh, Soon Lock
Year of Publication 01.10.2019
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Year of Publication 01.10.2019
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Molded Cavity Package with Embedded Conductive Layer and Enhanced Sealing
Chua Kok Yau, Lee Swee Kah, Theuss Horst, Ng Chee Yang, Chiang Chau Fatt
Year of Publication 28.09.2017
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Year of Publication 28.09.2017
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Leiterrahmenbasiertes Halbleitergehäuse
Lee, Swee Kah, Hetzel, Wolfgang, Macheiner, Stefan, Cha, Chan Lam, Scharf, Thomas
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
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