Impact of Low-k Devices on Failure Mode of Flip Chip Tensile Pull Test
Endut, Zulkarnain, Ahmad, Ibrahim, Lee How Swee, Gary, Sukemi, Norazham Mohd
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Solder Bump Strength and Failure Mode of Low-k Flip Chip Device
Endut, Z., Ahmad, I., Swee, G.L.H., Sukemi, N.M.
Published in 2006 IEEE International Conference on Semiconductor Electronics (01.11.2006)
Published in 2006 IEEE International Conference on Semiconductor Electronics (01.11.2006)
Get full text
Conference Proceeding