A preliminary study on the Soft Defects Modeling and Measurement Method using Time-domain Reflectometry
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Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Electrical package defect testing for volume production
Xue Ming, Johann, Koelz, Lee Chow York, Lee Kwan Wee, Shi Zhi Min
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
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Conference Proceeding
Test pin configuration for test device for testing devices under test
Sugianto, Yusman, Swee Lee, Gan, Chyeo Yong, Tay, Tan, Wee Kuan, Hudda, Murad, Hiew, Fu San, Yussuff, Arieff Ridzwan, Tan, Siao Kiat, Xiaojun, Wang, Dandong, Ge, Chow York, Lee
Year of Publication 05.02.2019
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Year of Publication 05.02.2019
Patent
Test Pin Configuration for Test Device for Testing Devices Under Test
TAN Wee Kuan, HIEW Fu San, TAN Siao Kiat, YUSSUFF Arieff Ridzwan, CHYEO YONG Tay, SUGIANTO Yusman, CHOW YORK Lee, SWEE LEE Gan, DANDONG Ge, HUDDA Murad, XIAOJUN Wang
Year of Publication 22.06.2017
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Year of Publication 22.06.2017
Patent
Prüfstiftkonfiguration für eine Prüfvorrichtung zum Prüfen von Prüflingen
Sugianto, Yusman, Gan, Swee Lee, Hudda, Murad, Tan, Wee Kuan, Hiew, Fu San, Yussuff, Arieff Ridzwan, Lee, Chow York, Tan, Siao Kiat, Ge, Dandong, Wang, Xiaojun, Tay, Chyeo Yong
Year of Publication 22.06.2017
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Year of Publication 22.06.2017
Patent