Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications
Lee, Tzu-Nien, Lau, John-H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru-Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia-Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in Materials (24.03.2022)
Published in Materials (24.03.2022)
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Journal Article
Fan-Out Panel-Level Packaging of Mini-LED RGB Display
Lau, John H., Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
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Journal Article
High-Density Hybrid Substrate for Heterogeneous Integration
Peng, Tony Chia-Yu, Lau, John H., Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Kai-Ming, Lin, Bruce Puru, Xia, Tim, Chang, Leo, Liu, Hsing-Ning, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)
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Journal Article
Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications
Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Development of High-Density Hybrid Substrate for Heterogeneous Integration
Peng, Chia-Yu, Lau, John H, Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Xia, Tim, Chang, Leo, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
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Conference Proceeding
Characterization of Low Loss Dielectric Materials for 5G Applications
Lee, Tzu Nien, Lau, John H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Henry Kai-Ming, Lin, Puru Bruce, Peng, Tony Chia-Yu, Chang, Leo, Chen, Jia Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
Published in 2021 IEEE CPMT Symposium Japan (ICSJ) (10.11.2021)
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Conference Proceeding
Design, Materials, Process, Fabrication, and Reliability of Mini-LED RGB Display by Fan-Out Panel-Level Packaging
Lau, John H, Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Sensing properties of electrolyte-insulator-semiconductor capacitors with nanoscale patterns fabricated by nano imprint lithography
Huang, Yo-Chen, Lee, Tzu Nien, Chen, Henry J.H., Hsieh, Kuang Chien
Published in 2017 International Conference on Applied System Innovation (ICASI) (01.05.2017)
Published in 2017 International Conference on Applied System Innovation (ICASI) (01.05.2017)
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Conference Proceeding
Ion-sensitive field-effect transistors with multiple Ω-shaped nano channels fabricated by nanoimprint lithography and NEMS process
Shang-Yi Lu, Tzu-Nien Lee, Chen, Henry J. H., Kuang-Chien Hsieh
Published in 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) (01.08.2016)
Published in 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) (01.08.2016)
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Conference Proceeding