Packages with multi-thermal interface materials and methods of fabricating the same
Lee, Pu-Sheng, Chang, Chien-Kuo, Meng, Hsien-Liang, Lin, Chih-Hao, Li, Fu-Jen
Year of Publication 10.08.2021
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Year of Publication 10.08.2021
Patent
PACKAGES WITH MULTI-THERMAL INTERFACE MATERIALS AND METHODS OF FABRICATING THE SAME
LIN, Chih-Hao, CHANG, Chien-Kuo, MENG, Hsien-Liang, LEE, Pu-Sheng, LI, Fu-Jen
Year of Publication 21.05.2020
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Year of Publication 21.05.2020
Patent