Packages with enlarged through-vias in encapsulant
Tsai, Hui-Jung, Kuo, Hung-Jui, Lee, Ming-Tan, Chang, Tai-Min, Lu, De-Yuan
Year of Publication 21.11.2023
Get full text
Year of Publication 21.11.2023
Patent
PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
Tsai, Hui-Jung, Kuo, Hung-Jui, Lee, Ming-Tan, Chang, Tai-Min, Lu, De-Yuan
Year of Publication 16.11.2023
Get full text
Year of Publication 16.11.2023
Patent