A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels
Park, Junyong, Choi, Sumin, Kim, Jonghoon J., Kim, Youngwoo, Lee, Manho, Kim, Heegon, Bae, Bumhee, Song, Huijin, Cho, Kyungjun, Lee, Seongsoo, Lee, Hyunsuk, Kim, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.10.2018)
Published in IEEE transactions on electromagnetic compatibility (01.10.2018)
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Journal Article
Ground guard structure to reduce the crosstalk noise and electromagnetic interference (EMI) in a vertical probe card for wafer-level testing
Eunjung Lee, Manho Lee, Kim, Jonghoon J., Mijoo Kim, Jonghoon Kim, Joungho Kim, Jeoungkun Park, Younghoon Joo, Yoonhee Bang, Il Kim, Seungki Nam
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
Novel Optimization Methodology of Design Parameters in High-Speed Differential Via for PCIe Gen5 Channels Based on Particle Swarm Optimization Algorithm
Cho, Chulhee, Kim, Kwangho, Lee, Manho, Shin, Jaeyoung, Yoon, Sungjin, Lee, Youngjae, Song, Chayoung, Choi, Wooshin, Kwak, Myoungbo, Choi, Youngdon, Choi, Jung-Hwan, Ko, Hyungjong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2023)
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Journal Article
Noise coupling emulation between TSV and active circuit through metal oxide patch
Manho Lee, Jonghyun Cho, Jaemin Lim, Joungho Kim
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC
Lim, Jaemin, Cho, Jonghyun, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Kim, Dong-Hyun, Lee, Manho, Kim, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.12.2018)
Published in IEEE transactions on electromagnetic compatibility (01.12.2018)
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Journal Article
Noise coupling analysis between TSV and active circuit
Manho Lee, Jonghyun Cho, Joungho Kim
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)
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Conference Proceeding
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC
Jaemin Lim, Manho Lee, Jung, Daniel H., Kim, Jonghoon J., Sumin Choi, Hyunsuk Lee, Joungho Kim
Published in 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) (01.11.2015)
Published in 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) (01.11.2015)
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Conference Proceeding
Noise coupling of through-via in silicon and glass interposer
Manho Lee, Jonghyun Cho, Joohee Kim, Joungho Kim, Jiseong Kim
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System
Park, Shinyoung, Song, Jinwook, Kim, Subin, Kim, Youngwoo, Lee, Manho, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2018)
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Journal Article
Design of on-chip linear voltage regulator module and measurement of power distribution network noise fluctuation at high-speed output buffer
Manho Lee, Heegon Kim, Sukjin Kim, Joungho Kim, Jonghyun Cho, Changwook Yoon, Achkir, Brice, Jingook Kim, Jun Fan
Published in 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2015)
Published in 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2015)
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Conference Proceeding
Journal Article