Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow
Mei Lee, Liu, Haliman, Habsah, Azmin Mohamad, Ahmad
Published in Soldering & surface mount technology (01.01.2013)
Published in Soldering & surface mount technology (01.01.2013)
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Journal Article
Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu : A Review
Lee, Liu Mei, Mohamad, Ahmad Azmin
Published in Advances in materials science and engineering (01.01.2013)
Published in Advances in materials science and engineering (01.01.2013)
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Journal Article
Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte
Liew, Mui Chee, Ahmad, Ibrahym, Lee, Liu Mei, Nazeri, Muhammad Firdaus Mohd, Haliman, Habsah, Mohamad, Ahmad Azmin
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.10.2012)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.10.2012)
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Journal Article
The Establishment and Examination of the Reliability, Validity, Discrimination, and Difficulty of Nursing Objective Structured Clinical Examination (OSCE)
Huang, Hsiang-Ping, Chao, Li-Fen, Wang, Yu-Hsin, Liu, Ying-Mei, Ni, Lee-Fen, Jane, Sui-Whi
Published in Hu li za zhi (01.12.2017)
Published in Hu li za zhi (01.12.2017)
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