A Study on the Void Formation in Residual Wall Thickness of Fluid-Assisted Injection Molding Parts
Lee, Kye-Hwan, Kim, Dong-Han, Choi, Jae-Hyuk, Park, Soo-Bin, Cha, Baeg-Soon, Park, Hyung-Pil, Rhee, Byung-Ohk
Published in Advances in materials science and engineering (01.01.2014)
Published in Advances in materials science and engineering (01.01.2014)
Get full text
Journal Article
Inter-Layer PCE Based Scalable Packet Forwarding with ID/Loc Separation
Kye-Hwan Lee, Taesang Choi, Young-Tak Kim
Published in 2010 IEEE International Conference on Communications (01.05.2010)
Published in 2010 IEEE International Conference on Communications (01.05.2010)
Get full text
Conference Proceeding
아시아 · 태평양지역의 잡초연구 동향과 전망
이인용(In-Yong Lee), 김진원(Jin-Won Kim), 김상수(Sang-Su Kim), 유홍재(Hong-Jae Yoo), 황인성(In-Seong Hwang), 이계환(Kye-Hwan Lee), 조남규(Nam-Gyu Cho), 이동국(Dong-Guk Lee), 황기환(Ki-Hwan Hwang), 원옥재(Ok Jae Won), Weiqiang Jia, 고영관(Young-Kwan Ko), 최정섭(Jung-Sup Choi), 염현석(Hyun-Suk Yeom), 박기웅(Kee Woong Park)
Published in Weed & turfgrass science (2017)
Published in Weed & turfgrass science (2017)
Get full text
Journal Article
Gas-assisted powder injection molding: A study about residual wall thickness
Kim, Donghan, Ahn, Seokyoung, Lee, Kye Hwan, Nambiar, Rajiv, Chung, Sang Won, Park, Seong Jin, German, Randall M.
Published in Powder technology (01.05.2013)
Published in Powder technology (01.05.2013)
Get full text
Journal Article